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Bilayer ambipolar organic thin-film transistors and inverters prepared by the contact-film-transfer method.

Bilayer ambipolar organic thin-film transistors and inverters prepared by the... Ambipolar organic thin-film transistors with a bilayer structure of poly(3-hexylthiophene) and [6,6]phenyl C(61) butyric acid methyl ester were fabricated using a simple solution-based, contact-film-transfer method. The transistors exhibited balanced electron and hole mobilities of 2.1 x 10(-2) and 1.1 x 10(-2) cm(2) V(-1) s(-1), respectively. Complementary inverters based on two identical ambipolar transistors showed good performance with a gain of 14. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACS Applied Materials & Interfaces Pubmed

Bilayer ambipolar organic thin-film transistors and inverters prepared by the contact-film-transfer method.

ACS Applied Materials & Interfaces , Volume 1 (9): -1856 – Apr 30, 2010

Bilayer ambipolar organic thin-film transistors and inverters prepared by the contact-film-transfer method.


Abstract

Ambipolar organic thin-film transistors with a bilayer structure of poly(3-hexylthiophene) and [6,6]phenyl C(61) butyric acid methyl ester were fabricated using a simple solution-based, contact-film-transfer method. The transistors exhibited balanced electron and hole mobilities of 2.1 x 10(-2) and 1.1 x 10(-2) cm(2) V(-1) s(-1), respectively. Complementary inverters based on two identical ambipolar transistors showed good performance with a gain of 14.

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ISSN
1944-8244
DOI
10.1021/am9004545
pmid
20355807

Abstract

Ambipolar organic thin-film transistors with a bilayer structure of poly(3-hexylthiophene) and [6,6]phenyl C(61) butyric acid methyl ester were fabricated using a simple solution-based, contact-film-transfer method. The transistors exhibited balanced electron and hole mobilities of 2.1 x 10(-2) and 1.1 x 10(-2) cm(2) V(-1) s(-1), respectively. Complementary inverters based on two identical ambipolar transistors showed good performance with a gain of 14.

Journal

ACS Applied Materials & InterfacesPubmed

Published: Apr 30, 2010

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