In automotive industry, reliability analysis of smart power semiconductor devices is mandatory for safety reasons. To reliably forecast the lifetime of devices, a mathematical description of the material degradation due to applied stress is required. In this work, the degradation process of a metal film of interest under thermo‐mechanical stress is studied. Therefore, a bi‐layer test structure (metal film on substrate) is used. Degradation refers to the formation, growth and coalescence of voids, initializing cracks that propagate through the metal film. Since the film's elastic‐plastic deformation is triggered by random diffusional activities with drift, stochastic differential equations (SDEs) are used to model the evolution of the microstructural heterogeneity in the metallization.
Proceedings in Applied Mathematics & Mechanics – Wiley
Published: Jan 1, 2017
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