Issue Information: Plasma Process. Polym. 3/2018

Issue Information: Plasma Process. Polym. 3/2018 Contents Contents Contents Front Cover: Chloride regulates the sterilization eff ect by plasma depending on the working gas. It potentiates O plasma-induced, but attenuates N and air plasma-induced bacterial inactivation (top-panel fi gures). The potentiation eff ect was attributed to the generation of HOCl and the increase of reactive oxygen species (ROS) levels. The attenuation eff ect was due to the reaction of gen- erated HOCl with NO - and H O , which decreased the reactive 2 2 2 oxygen and nitrogen species (RONS) levels. Further details can be found in the article by Zhigang Ke, Zhu Chen and Qing Huang (e1700153). Communications Vacuum Ultraviolet (VUV) absorption and Photoabsorption and Damage of OSG damage of nanoporous organosilicate glass Low-k Films by VUV Emission at (OSG) low-k dielectrics in the wavelength 140–160 nm range 140–160 nm is studied. VUV damage of OSG dielectrics very slowly decreases with in- D. V. Lopaev, V. V. Rakhlinsky, creasing wavelength compared to SiO2 which S. M. Zyryanov, Y. A. Mankelevich, absorption sharply drops reaching the absorp- T. V. Rakhimova, K. A. Kurchikov, tion edge. The possible absorption and damage M. R. Baklanov mechanisms are briefl y discussed. Plasma Process. Polym. 2018, 15, 1700166 http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Plasma Processes and Polymers Wiley

Issue Information: Plasma Process. Polym. 3/2018

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Publisher
Wiley
Copyright
© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
ISSN
1612-8850
eISSN
1612-8869
D.O.I.
10.1002/ppap.201870007
Publisher site
See Article on Publisher Site

Abstract

Contents Contents Contents Front Cover: Chloride regulates the sterilization eff ect by plasma depending on the working gas. It potentiates O plasma-induced, but attenuates N and air plasma-induced bacterial inactivation (top-panel fi gures). The potentiation eff ect was attributed to the generation of HOCl and the increase of reactive oxygen species (ROS) levels. The attenuation eff ect was due to the reaction of gen- erated HOCl with NO - and H O , which decreased the reactive 2 2 2 oxygen and nitrogen species (RONS) levels. Further details can be found in the article by Zhigang Ke, Zhu Chen and Qing Huang (e1700153). Communications Vacuum Ultraviolet (VUV) absorption and Photoabsorption and Damage of OSG damage of nanoporous organosilicate glass Low-k Films by VUV Emission at (OSG) low-k dielectrics in the wavelength 140–160 nm range 140–160 nm is studied. VUV damage of OSG dielectrics very slowly decreases with in- D. V. Lopaev, V. V. Rakhlinsky, creasing wavelength compared to SiO2 which S. M. Zyryanov, Y. A. Mankelevich, absorption sharply drops reaching the absorp- T. V. Rakhimova, K. A. Kurchikov, tion edge. The possible absorption and damage M. R. Baklanov mechanisms are briefl y discussed. Plasma Process. Polym. 2018, 15, 1700166

Journal

Plasma Processes and PolymersWiley

Published: Jan 1, 2018

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