Study on diamond dressing for non-uniformity of pad surface topography in CMP process

Study on diamond dressing for non-uniformity of pad surface topography in CMP process Diamond dressing process is critical in conditioning pad surface topography before and after chemical mechanical planarization/polishing (CMP) process for integrated circuit (IC) fabrication. This paper addresses a kinematic model of diamond dressing effect on the profile of pad cutting rate (PCR) with a ring-type diamond dresser through both simulation and experiments. In this kinematic model, the cutting locus distribution, relative velocity of diamond grits on a pad surface, and sliding time have been described as significant factors for non-uniformity of pad surface topography. Moreover, the speed ratio between the diamond dresser and the polishing pad has been investigated with respect to the center distance of the pad and the diamond dresser by the developed method. The model has been verified by experiments of diamond dressing of pad. Experimental results show that the dressing marks and pad cutting rate on the pad surface follow the same trend as simulation results and the final pad surface is obtained as a concave shape. Results of this study can be applied on diamond dressing of pads used in CMP and furthermore can be extended to investigate an optimal diamond dressing process for semiconductor fabrication. The International Journal of Advanced Manufacturing Technology Springer Journals

Study on diamond dressing for non-uniformity of pad surface topography in CMP process

Loading next page...
Springer London
Copyright © 2017 by Springer-Verlag London
Engineering; Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design
Publisher site
See Article on Publisher Site


You’re reading a free preview. Subscribe to read the entire article.

DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 12 million articles from more than
10,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Unlimited reading

Read as many articles as you need. Full articles with original layout, charts and figures. Read online, from anywhere.

Stay up to date

Keep up with your field with Personalized Recommendations and Follow Journals to get automatic updates.

Organize your research

It’s easy to organize your research with our built-in tools.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

Monthly Plan

  • Read unlimited articles
  • Personalized recommendations
  • No expiration
  • Print 20 pages per month
  • 20% off on PDF purchases
  • Organize your research
  • Get updates on your journals and topic searches


Start Free Trial

14-day Free Trial

Best Deal — 39% off

Annual Plan

  • All the features of the Professional Plan, but for 39% off!
  • Billed annually
  • No expiration
  • For the normal price of 10 articles elsewhere, you get one full year of unlimited access to articles.



billed annually
Start Free Trial

14-day Free Trial