Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder The work is devoted to the study of direct soldering of a substrate of Al2O3 ceramics with a Cu substrate by use of Bi11Ag2La solder. Soldering was realised by fluxless method in air by activation with power ultrasound. It was found out that lanthanum is during the ultrasonic soldering process distributed to the interface with Al2O3 substrate, enhancing thus the bond formation. The bond with ceramic substrate has adhesive character without formation of a new contact interlayer. The shear strength of joint with Al2O3 ceramics is 20 MPa. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Welding in the World Springer Journals

Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder

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Publisher
Springer Berlin Heidelberg
Copyright
Copyright © 2017 by International Institute of Welding
Subject
Materials Science; Metallic Materials; Continuum Mechanics and Mechanics of Materials; Theoretical and Applied Mechanics
ISSN
0043-2288
eISSN
1878-6669
D.O.I.
10.1007/s40194-017-0538-6
Publisher site
See Article on Publisher Site

Abstract

The work is devoted to the study of direct soldering of a substrate of Al2O3 ceramics with a Cu substrate by use of Bi11Ag2La solder. Soldering was realised by fluxless method in air by activation with power ultrasound. It was found out that lanthanum is during the ultrasonic soldering process distributed to the interface with Al2O3 substrate, enhancing thus the bond formation. The bond with ceramic substrate has adhesive character without formation of a new contact interlayer. The shear strength of joint with Al2O3 ceramics is 20 MPa.

Journal

Welding in the WorldSpringer Journals

Published: Dec 19, 2017

References

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