ISSN 1063-7397, Russian Microelectronics, 2017, Vol. 46, No. 3, pp. 166–170. © Pleiades Publishing, Ltd., 2017.
Original Russian Text © P.K. Skorobogatov, O.A. Gerasimchuk, K.A. Epifantsev, V.A. Telets, 2017, published in Mikroelektronika, 2017, Vol. 46, No. 3, pp. 181–186.
Specifics of Electromagnetic Radiation Effects on Integrated Circuits
P. K. Skorobogatov
*, O. A. Gerasimchuk
**, K. A. Epifantsev
***, and V. A. Telets
National Research Nuclear University MEPhI, Moscow, 115409 Russia
Specialized Electronic Systems (SPELS), Moscow, 115409 Russia
Impul’snaya tekhnika Research and Production Center, Dukhov All-Russia Research Institute of Automatics, 115304 Russia
Received November 1, 2016
Abstract⎯Modern regulations  stress the necessity of testing integrated circuits (ICs) in order to determine
the real level of their resistance to single voltage pulses induced by electromagnetic radiation (EMR). With
expansion of the EMR spectral composition, however, direct energy release can occur due to the absorption
of the EMR field energy by the IC chip itself. To assess this possibility, the relationship is found between dif-
ferent mechanisms of the EMR-induced energy release for the typical irradiation geometry.
1. EVALUATING ENERGY RELEASE
IN AN IC CHIP EXPOSED TO THE EMR FIELD
The first experimental investigations and tests of
electronic equipment by using microwave generators
showed that, as the duration of the acting field’s edge
gets shorter, protection devices lose their effectiveness;
thus, it becomes easier for electromagnetic fields to
penetrate through inhomogeneities in frameworks and
easier for the induced currents and voltages across
integrated circuit (IC) outputs to grow in amplitude.
The typical irradiation geometry for the IC exposed
to the electromagnetic radiation (EMR) field is shown
in Fig. 1.
A semiconductor chip 250 to 700 μm thick is
placed on a metal base. The EMR energy causes the
energy release in the semiconductor with the following
two basic mechanisms:
⎯induction of pickups on the IC power-supply
pins with the subsequent energy transfer to the chip;
⎯direct absorption of some of the EMR field
energy by the IC chip.
Fig. 1. IC chip in field of plane electromagnetic wave.