Smoothing effect of the thermal interface material on the temperature distribution in a stepwise varying width microchannel cooling device

Smoothing effect of the thermal interface material on the temperature distribution in a stepwise... The impact of the thermal interface material (TIM) layer on the performance of a stepwise varying width microchannel cooling device is analysed. A numerical model shows that the TIM layer, besides its well known negative impact on the temperature, also generates a smoothing effect on the temperature distribution. In this study, an analytical model is used to define a nondimensional parameter, called Smoothing Resistance ratio, as the quotient between the origin of the temperature non uniformities and the TIM thermal resistance that flatten the temperature distribution. The relationship between the temperature uniformity of the cooled device, expressed through the temperature standard deviation, and the Smoothing Resistance ratio is shown to be linear. These results lead to the definition of a new design procedure for this kind of cooling device, which aims to reduce the Smoothing Resistance ratio. Two solutions are identified and their drawbacks are analysed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Heat and Mass Transfer Springer Journals

Smoothing effect of the thermal interface material on the temperature distribution in a stepwise varying width microchannel cooling device

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Publisher
Springer Journals
Copyright
Copyright © 2017 by Springer-Verlag Berlin Heidelberg
Subject
Engineering; Engineering Thermodynamics, Heat and Mass Transfer; Industrial Chemistry/Chemical Engineering; Thermodynamics
ISSN
0947-7411
eISSN
1432-1181
D.O.I.
10.1007/s00231-017-2045-0
Publisher site
See Article on Publisher Site

Abstract

The impact of the thermal interface material (TIM) layer on the performance of a stepwise varying width microchannel cooling device is analysed. A numerical model shows that the TIM layer, besides its well known negative impact on the temperature, also generates a smoothing effect on the temperature distribution. In this study, an analytical model is used to define a nondimensional parameter, called Smoothing Resistance ratio, as the quotient between the origin of the temperature non uniformities and the TIM thermal resistance that flatten the temperature distribution. The relationship between the temperature uniformity of the cooled device, expressed through the temperature standard deviation, and the Smoothing Resistance ratio is shown to be linear. These results lead to the definition of a new design procedure for this kind of cooling device, which aims to reduce the Smoothing Resistance ratio. Two solutions are identified and their drawbacks are analysed.

Journal

Heat and Mass TransferSpringer Journals

Published: Apr 10, 2017

References

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