The effect of hydroxyethylidenediphosphonic acid (HEDP) on the kinetics of copper(II) oxide dissolution in aqueous sulfuric acid was studied. The addition of HEDP in acidic media decreases the CuO dissolution rate. The simulation of these processes showed that the inhibiting effect is due to the decrease in the concentration of the intermediate compound (CuOH+), which restricts the dissolution of Cu2+ ions, due to adsorption of the HEDP ions (H4Y−) on the oxide surface.
Russian Journal of Coordination Chemistry – Springer Journals
Published: Sep 6, 2006
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