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Silicon Dioxide Sol as a Component of Urea-Formaldehyde Adhesive

Silicon Dioxide Sol as a Component of Urea-Formaldehyde Adhesive The possibility of combining an inorganic polymer, silicon dioxide sol, with urea-formaldehyde resins, was studied with the aim to prepare a binding agent for producing nontoxic chip boards. The kinetic characteristics of formaldehyde binding with silicon dioxide during complex binder curing were determined. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Journal of Applied Chemistry Springer Journals

Silicon Dioxide Sol as a Component of Urea-Formaldehyde Adhesive

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References (5)

Publisher
Springer Journals
Copyright
Copyright © 2002 by MAIK “Nauka/Interperiodica”
Subject
Chemistry; Chemistry/Food Science, general
ISSN
1070-4272
eISSN
1608-3296
DOI
10.1023/A:1020981532085
Publisher site
See Article on Publisher Site

Abstract

The possibility of combining an inorganic polymer, silicon dioxide sol, with urea-formaldehyde resins, was studied with the aim to prepare a binding agent for producing nontoxic chip boards. The kinetic characteristics of formaldehyde binding with silicon dioxide during complex binder curing were determined.

Journal

Russian Journal of Applied Chemistry – Springer Journals

Published: Oct 13, 2004

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