In this research, the shielding effect of Ag3Sn particles on Cu6Sn5 grain boundaries in isothermal heating and cooling of multiple reflows was investigated in Sn/Cu and Sn3.5Ag/Cu solder bumps by utilizing the real-time imaging technology of Shanghai Synchrotron Radiation Facility as well as scanning electron microscope. Results show that controlled by volume diffusion growth mechanism, the value of time exponent n for Sn is much closer to 1/2 with increasing reflow cycle than for Sn3.5Ag that governed by both grain boundary and volume diffusion mechanisms in isothermal heating. Consequently, IMC increment in Sn3.5Ag is larger than in Sn due to the Cu supplement effect of J* in−b in cooling during multiple reflows. The reason for the phenomena may be the shielding effect of Ag3Sn nano particles on grain boundaries in Sn3.5Ag during multiple reflow process.
Journal of Materials Science: Materials in Electronics – Springer Journals
Published: Jan 6, 2018
It’s your single place to instantly
discover and read the research
that matters to you.
Enjoy affordable access to
over 12 million articles from more than
10,000 peer-reviewed journals.
All for just $49/month
Read as many articles as you need. Full articles with original layout, charts and figures. Read online, from anywhere.
Keep up with your field with Personalized Recommendations and Follow Journals to get automatic updates.
It’s easy to organize your research with our built-in tools.
Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.
All the latest content is available, no embargo periods.
“Hi guys, I cannot tell you how much I love this resource. Incredible. I really believe you've hit the nail on the head with this site in regards to solving the research-purchase issue.”Daniel C.
“Whoa! It’s like Spotify but for academic articles.”@Phil_Robichaud
“I must say, @deepdyve is a fabulous solution to the independent researcher's problem of #access to #information.”@deepthiw
“My last article couldn't be possible without the platform @deepdyve that makes journal papers cheaper.”@JoseServera