Rheological characterization and jet printing performance of Sn–58Bi solder pastes

Rheological characterization and jet printing performance of Sn–58Bi solder pastes The rheological character and jet printing performance of the lead-free solder paste (Sn–58Bi) with four solid phases were investigated. The rheology tests, containing oscillation test, creep recovery test, viscosity test and thixotropic loop test, were conducted by an Anton Paar MCR302 rheometer. Jet printing technology is a new packaging method with many advantages such as high precision, customization, low cost, etc. The jet printing test was carried out with the spray nozzle heated to 50 °C. From this study, it is found that the G″/G′ ratio of the pastes obtained by the oscillation stress test can influence the jet printing performance of the pastes. Paste 2 with the lowest ratio of G″/G′ can form the most complete hemispherical droplet. In addition, the solder paste with better liquid-like character at the nozzle and more solid phase property and surface tension when crashing on the base plate could be reverted to the hemispherical morphology easily. As the demand for pastes applied to jet printing increases, rheological measurement can assist with the research of the new high viscosity lead-free solder pastes. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Materials Science: Materials in Electronics Springer Journals

Rheological characterization and jet printing performance of Sn–58Bi solder pastes

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Publisher
Springer US
Copyright
Copyright © 2017 by Springer Science+Business Media, LLC, part of Springer Nature
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials
ISSN
0957-4522
eISSN
1573-482X
D.O.I.
10.1007/s10854-017-8408-y
Publisher site
See Article on Publisher Site

Abstract

The rheological character and jet printing performance of the lead-free solder paste (Sn–58Bi) with four solid phases were investigated. The rheology tests, containing oscillation test, creep recovery test, viscosity test and thixotropic loop test, were conducted by an Anton Paar MCR302 rheometer. Jet printing technology is a new packaging method with many advantages such as high precision, customization, low cost, etc. The jet printing test was carried out with the spray nozzle heated to 50 °C. From this study, it is found that the G″/G′ ratio of the pastes obtained by the oscillation stress test can influence the jet printing performance of the pastes. Paste 2 with the lowest ratio of G″/G′ can form the most complete hemispherical droplet. In addition, the solder paste with better liquid-like character at the nozzle and more solid phase property and surface tension when crashing on the base plate could be reverted to the hemispherical morphology easily. As the demand for pastes applied to jet printing increases, rheological measurement can assist with the research of the new high viscosity lead-free solder pastes.

Journal

Journal of Materials Science: Materials in ElectronicsSpringer Journals

Published: Dec 13, 2017

References

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