Research on residual stresses during hot stamping with flat and local-thickened plates

Research on residual stresses during hot stamping with flat and local-thickened plates Residual stresses generated during hot stamping have a significant effect on the mechanical properties and dimensional stability of aluminum alloy sheet components. What is more, few studies have paid attentions to the effects of hot stamping parameters on residual stresses and the methods of reducing residual stresses during hot stamping of aluminum alloy plates with thickness around 5 mm. Hence, in this study, the effects of forming temperature, blank holder force, die entrance radius, die corner radius, and local thickening on the residual stresses of square cups were studied, by conducting both finite element simulations and experiment investigations of the hot stamping of 2024 aluminum alloy plates. The results showed that the residual stress distribution is not uniform through the thickness. Within the range of process parameters investigated in this study, increasing the forming temperature, blank holder force, and die corner radius or decreasing the die entrance radius all lead to lower values of residual stresses. Compared to flat plates, local-thickened plates can significantly reduce the residual stresses in hot stamped square cups, which is attributed to the metal supplement mechanism at the thickened locations. When the side length of the square-ring-shaped convex rib of the plate is equal to the punch width and the convex rib facing downward, lower residual stresses in square cups are obtained. The established residual stress calculation model is capable of describing the residual stress distribution in the bottom circular arc of hot stamped square cups. The International Journal of Advanced Manufacturing Technology Springer Journals

Research on residual stresses during hot stamping with flat and local-thickened plates

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Springer London
Copyright © 2017 by Springer-Verlag London
Engineering; Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design
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