Regeneration by Membrane Electrolysis of an Etching Solution Based on Copper Chloride

Regeneration by Membrane Electrolysis of an Etching Solution Based on Copper Chloride Regeneration of an acid solution for copper etching, based on copper(II) chloride, hydrochloric acid, and ammonium chloride, by membrane electrolysis was studied. The concentrations of copper(I, II) ions in the cathode and anode spaces, current efficiency, degree of copper recovery, and specific consumption of electric power at different quantities of electricity passed through the electrolyzer were measured. The influence exerted by the current density on the electric power expenditure for recovery of metallic copper was examined. The anode current efficiency by chlorine was determined with a spent etching solution and an H2SO4 solution used as anolyte. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Journal of Applied Chemistry Springer Journals

Regeneration by Membrane Electrolysis of an Etching Solution Based on Copper Chloride

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Publisher
Nauka/Interperiodica
Copyright
Copyright © 2005 by MAIK "Nauka/Interperiodica"
Subject
Chemistry; Industrial Chemistry/Chemical Engineering; Chemistry/Food Science, general
ISSN
1070-4272
eISSN
1608-3296
D.O.I.
10.1007/s11167-005-0535-1
Publisher site
See Article on Publisher Site

Abstract

Regeneration of an acid solution for copper etching, based on copper(II) chloride, hydrochloric acid, and ammonium chloride, by membrane electrolysis was studied. The concentrations of copper(I, II) ions in the cathode and anode spaces, current efficiency, degree of copper recovery, and specific consumption of electric power at different quantities of electricity passed through the electrolyzer were measured. The influence exerted by the current density on the electric power expenditure for recovery of metallic copper was examined. The anode current efficiency by chlorine was determined with a spent etching solution and an H2SO4 solution used as anolyte.

Journal

Russian Journal of Applied ChemistrySpringer Journals

Published: Nov 24, 2005

References

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