Physicochemical deposition features of peritectic alloys for high-density chipping of silicon crystals

Physicochemical deposition features of peritectic alloys for high-density chipping of silicon... Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn–Ag peritectic composition for chipping integrated microcircuits by the inverted crystal method are considered. The layer-by-layer deposition of metals is investigated and the conditions of the vertical growth of the structures are determined. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Physicochemical deposition features of peritectic alloys for high-density chipping of silicon crystals

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Publisher
Pleiades Publishing
Copyright
Copyright © 2016 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739716040090
Publisher site
See Article on Publisher Site

Abstract

Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn–Ag peritectic composition for chipping integrated microcircuits by the inverted crystal method are considered. The layer-by-layer deposition of metals is investigated and the conditions of the vertical growth of the structures are determined.

Journal

Russian MicroelectronicsSpringer Journals

Published: Sep 16, 2016

References

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