New VLSI Multilevel Metallization Technology Using Polyimide Insulation

New VLSI Multilevel Metallization Technology Using Polyimide Insulation The fabrication of reliable VLSI multilevel metal interconnections using polypyromellitimide as an interlevel insulator is studied experimentally. A new process that enables one to considerably improve insulation performance is described. The improvement is achieved by optimizing the conversion of a polyamidoacid to a polyimide and by covering the wafer with a layer of functional groups that are to react with the polymer. The former reduces the water content of the polyimide, and the latter provides good adhesion to the semiconductor. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

New VLSI Multilevel Metallization Technology Using Polyimide Insulation

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Publisher
Springer Journals
Copyright
Copyright © 2002 by MAIK "Nauka/Interperiodica"
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1023/A:1015411020018
Publisher site
See Article on Publisher Site

Abstract

The fabrication of reliable VLSI multilevel metal interconnections using polypyromellitimide as an interlevel insulator is studied experimentally. A new process that enables one to considerably improve insulation performance is described. The improvement is achieved by optimizing the conversion of a polyamidoacid to a polyimide and by covering the wafer with a layer of functional groups that are to react with the polymer. The former reduces the water content of the polyimide, and the latter provides good adhesion to the semiconductor.

Journal

Russian MicroelectronicsSpringer Journals

Published: Oct 13, 2004

References

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