# New approach to the mathematical modeling of thermal regimes for electronic equipment

New approach to the mathematical modeling of thermal regimes for electronic equipment A mathematical model is constructed for simulating thermal regimes of typical electronic building blocks. It describes convective heat transfer in an air-filled cavity having finitely thick heat-conducting walls and containing a heat source. On this basis, flow patterns, temperature fields, and vorticity-vector fields are computed that characterize the convective heat transfer over a range of natural-convection parameters found in practice. Nonstationarity is shown to be a determinant of thermal regimes attained by the system. Computational relations are derived representing the variation of the average Nusselt number with the Grashof number for the boundary of the cavity. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

# New approach to the mathematical modeling of thermal regimes for electronic equipment

Russian Microelectronics, Volume 37 (2) – Jan 19, 2011
8 pages

/lp/springer_journal/new-approach-to-the-mathematical-modeling-of-thermal-regimes-for-Jr0lifrjvy
Publisher
Springer Journals
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739708020078
Publisher site
See Article on Publisher Site

### Abstract

A mathematical model is constructed for simulating thermal regimes of typical electronic building blocks. It describes convective heat transfer in an air-filled cavity having finitely thick heat-conducting walls and containing a heat source. On this basis, flow patterns, temperature fields, and vorticity-vector fields are computed that characterize the convective heat transfer over a range of natural-convection parameters found in practice. Nonstationarity is shown to be a determinant of thermal regimes attained by the system. Computational relations are derived representing the variation of the average Nusselt number with the Grashof number for the boundary of the cavity.

### Journal

Russian MicroelectronicsSpringer Journals

Published: Jan 19, 2011

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