Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding Two types of diamond wheel with a mesh size of 20,000 are developed. A novel approach for mechanical chemical grinding (MCG) is proposed using the diamond wheels developed. A wear layer of 56 nm in thickness is obtained on a silicon wafer, which is ground by the diamond wheel with ceria at a feed rate of 20 μm/min. It consists of an amorphous layer at the top and a damage crystalline layer beneath. The thickness of the wear layer is less than one third those ground using a conventional diamond wheel with a mesh size of 3000. Surface roughness R a and peak-to-valley values keep basically constant at 1 and 9.8 nm, respectively, with increasing feed rates from 5 to 20 μm/min, which is ground by the diamond wheel with ceria. Nanoscale wear layers are obtained on Si wafers ground by MCG in high efficiency, which is different from the traditional diamond grinding with thick wear layers and chemical mechanical grinding with low efficiency. The ground Si wafers are bright and absent of cracks. MCG paves the way for the applications in semiconductor and electronics industries. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Tribology Letters Springer Journals

Nanoscale Wear Layers on Silicon Wafers Induced by Mechanical Chemical Grinding

Loading next page...
 
/lp/springer_journal/nanoscale-wear-layers-on-silicon-wafers-induced-by-mechanical-chemical-mqEuaNZNZ4
Publisher
Springer US
Copyright
Copyright © 2017 by Springer Science+Business Media, LLC
Subject
Materials Science; Tribology, Corrosion and Coatings; Surfaces and Interfaces, Thin Films; Theoretical and Applied Mechanics; Physical Chemistry; Nanotechnology
ISSN
1023-8883
eISSN
1573-2711
D.O.I.
10.1007/s11249-017-0911-z
Publisher site
See Article on Publisher Site

Abstract

Two types of diamond wheel with a mesh size of 20,000 are developed. A novel approach for mechanical chemical grinding (MCG) is proposed using the diamond wheels developed. A wear layer of 56 nm in thickness is obtained on a silicon wafer, which is ground by the diamond wheel with ceria at a feed rate of 20 μm/min. It consists of an amorphous layer at the top and a damage crystalline layer beneath. The thickness of the wear layer is less than one third those ground using a conventional diamond wheel with a mesh size of 3000. Surface roughness R a and peak-to-valley values keep basically constant at 1 and 9.8 nm, respectively, with increasing feed rates from 5 to 20 μm/min, which is ground by the diamond wheel with ceria. Nanoscale wear layers are obtained on Si wafers ground by MCG in high efficiency, which is different from the traditional diamond grinding with thick wear layers and chemical mechanical grinding with low efficiency. The ground Si wafers are bright and absent of cracks. MCG paves the way for the applications in semiconductor and electronics industries.

Journal

Tribology LettersSpringer Journals

Published: Sep 2, 2017

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 12 million articles from more than
10,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Unlimited reading

Read as many articles as you need. Full articles with original layout, charts and figures. Read online, from anywhere.

Stay up to date

Keep up with your field with Personalized Recommendations and Follow Journals to get automatic updates.

Organize your research

It’s easy to organize your research with our built-in tools.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

Monthly Plan

  • Read unlimited articles
  • Personalized recommendations
  • No expiration
  • Print 20 pages per month
  • 20% off on PDF purchases
  • Organize your research
  • Get updates on your journals and topic searches

$49/month

Start Free Trial

14-day Free Trial

Best Deal — 39% off

Annual Plan

  • All the features of the Professional Plan, but for 39% off!
  • Billed annually
  • No expiration
  • For the normal price of 10 articles elsewhere, you get one full year of unlimited access to articles.

$588

$360/year

billed annually
Start Free Trial

14-day Free Trial