The model and the results of the modeling of etching deep grooves in Si in Сl2/Ar plasma as a function of the energy of Cl+ and Ar+ incident ions (30–250 eV), taking into consideration the redeposition of the reaction products, which are removed from the groove bottom, are represented. The groove profiles with an aspect ratio (depth-to-width groove ratio) below 5 and Si atom yield coefficients per ion as a function of the incident ion energy were in agreement with the reference data. The profile evolution of the deep grooves with an aspect ratio (AR) of up to 10 at different energies of the incident ions is shown. The influence of the redeposition coefficient of the scattered particles and the shape of the mask on the groove profile is considered. The reasons for distorting the profile of the high-aspect grooves during their etching in the Сl2/Ar plasma are discussed.
Russian Microelectronics – Springer Journals
Published: May 19, 2016
It’s your single place to instantly
discover and read the research
that matters to you.
Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.
All for just $49/month
Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly
Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.
Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.
Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.
All the latest content is available, no embargo periods.
“Hi guys, I cannot tell you how much I love this resource. Incredible. I really believe you've hit the nail on the head with this site in regards to solving the research-purchase issue.”Daniel C.
“Whoa! It’s like Spotify but for academic articles.”@Phil_Robichaud
“I must say, @deepdyve is a fabulous solution to the independent researcher's problem of #access to #information.”@deepthiw
“My last article couldn't be possible without the platform @deepdyve that makes journal papers cheaper.”@JoseServera