Method of determining nondestructive pulsed laser annealing modes for dielectric and semiconductor wafers

Method of determining nondestructive pulsed laser annealing modes for dielectric and... Single-side heating of a wafer with a free surface by pulsed laser annealing has been analyzed within a quasi-static uncoupled thermoelasticity problem. An analytical relationship that can be used as a criterion of wafer thermal strength and helps to determine nondestructive modes of pulsed laser processing of dielectric and semiconductor wafers has been obtained. The model of calculation has been obtained under the assumption that the thermophysical, mechanical, and optical properties of the materials are temperatureindependent. The experimental verification of the adequacy of the model of calculation has shown quite a satisfactory agreement between the calculation and experimental data. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Method of determining nondestructive pulsed laser annealing modes for dielectric and semiconductor wafers

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Publisher
Springer Journals
Copyright
Copyright © 2015 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739715080090
Publisher site
See Article on Publisher Site

Abstract

Single-side heating of a wafer with a free surface by pulsed laser annealing has been analyzed within a quasi-static uncoupled thermoelasticity problem. An analytical relationship that can be used as a criterion of wafer thermal strength and helps to determine nondestructive modes of pulsed laser processing of dielectric and semiconductor wafers has been obtained. The model of calculation has been obtained under the assumption that the thermophysical, mechanical, and optical properties of the materials are temperatureindependent. The experimental verification of the adequacy of the model of calculation has shown quite a satisfactory agreement between the calculation and experimental data.

Journal

Russian MicroelectronicsSpringer Journals

Published: Nov 21, 2015

References

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