Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by... The mechanical properties of a molding compound on a packaged integrated circuit (IC) were measured by spherical nanoindentation using a 50 μm radius diamond tip. The molding compound is a heterogeneous material, consisting of assorted diameters of glass beads embedded in an epoxy. Statistical analysis was conducted to determine the representative volume element (RVE) size for a nanoindentation grid. Nanoindentation was made on the RVE to determine the effective viscoelastic properties. The relaxation functions were converted to temperature-dependent Young’s modulus at a given strain rate at several elevated temperatures. The Young’s modulus values at a given strain rate from nanoindentation were found to be in a good agreement with the corresponding data obtained from tensile samples at or below 90 °C. However, the values from nanoindentation were significantly lower than the data obtained from tensile samples when the temperature was near or higher than 110 °C, which is near the glass transition. The spatial distribution of the Young’s modulus at a given strain rate was determined using nanoindentation with a Berkovich tip. The spatial variation of the Young’s modulus at a given strain rate is due to the difference in nanoindentation sites (glass beads, epoxy or the interphase region). A graphical map made from an optical micrograph agrees reasonably well with the nanoindentation results. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Experimental Mechanics Springer Journals

Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

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Publisher
Springer US
Copyright
Copyright © 2016 by Society for Experimental Mechanics
Subject
Engineering; Continuum Mechanics and Mechanics of Materials; Characterization and Evaluation of Materials; Optics, Lasers, Photonics, Optical Devices; Structural Mechanics; Vibration, Dynamical Systems, Control; Classical Mechanics
ISSN
0014-4851
eISSN
1741-2765
D.O.I.
10.1007/s11340-016-0205-7
Publisher site
See Article on Publisher Site

Abstract

The mechanical properties of a molding compound on a packaged integrated circuit (IC) were measured by spherical nanoindentation using a 50 μm radius diamond tip. The molding compound is a heterogeneous material, consisting of assorted diameters of glass beads embedded in an epoxy. Statistical analysis was conducted to determine the representative volume element (RVE) size for a nanoindentation grid. Nanoindentation was made on the RVE to determine the effective viscoelastic properties. The relaxation functions were converted to temperature-dependent Young’s modulus at a given strain rate at several elevated temperatures. The Young’s modulus values at a given strain rate from nanoindentation were found to be in a good agreement with the corresponding data obtained from tensile samples at or below 90 °C. However, the values from nanoindentation were significantly lower than the data obtained from tensile samples when the temperature was near or higher than 110 °C, which is near the glass transition. The spatial distribution of the Young’s modulus at a given strain rate was determined using nanoindentation with a Berkovich tip. The spatial variation of the Young’s modulus at a given strain rate is due to the difference in nanoindentation sites (glass beads, epoxy or the interphase region). A graphical map made from an optical micrograph agrees reasonably well with the nanoindentation results.

Journal

Experimental MechanicsSpringer Journals

Published: Sep 23, 2016

References

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