The mechanical properties of a molding compound on a packaged integrated circuit (IC) were measured by spherical nanoindentation using a 50 μm radius diamond tip. The molding compound is a heterogeneous material, consisting of assorted diameters of glass beads embedded in an epoxy. Statistical analysis was conducted to determine the representative volume element (RVE) size for a nanoindentation grid. Nanoindentation was made on the RVE to determine the effective viscoelastic properties. The relaxation functions were converted to temperature-dependent Young’s modulus at a given strain rate at several elevated temperatures. The Young’s modulus values at a given strain rate from nanoindentation were found to be in a good agreement with the corresponding data obtained from tensile samples at or below 90 °C. However, the values from nanoindentation were significantly lower than the data obtained from tensile samples when the temperature was near or higher than 110 °C, which is near the glass transition. The spatial distribution of the Young’s modulus at a given strain rate was determined using nanoindentation with a Berkovich tip. The spatial variation of the Young’s modulus at a given strain rate is due to the difference in nanoindentation sites (glass beads, epoxy or the interphase region). A graphical map made from an optical micrograph agrees reasonably well with the nanoindentation results.
Experimental Mechanics – Springer Journals
Published: Sep 23, 2016
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