Lead-Free Solders in IC Manufacture: A Review

Lead-Free Solders in IC Manufacture: A Review The compositions and melting points of lead-free solders suitable for IC packaging are given. The use of tin–bismuth alloys for both this purpose and the corrosion protection of packages is outlined. An investigation is described into the dissolution of 0.04-mm-thick gold wire in the POIn50 tin–indium solder in the molten or solid state. In the former case the process is examined as a function of solder temperature and the contact time between the molten solder and the wire. In the latter case, dissolution kinetics is studied at 100°C. The soldering of gold-coated hybrid-IC substrates, including microwave ones, to metal bases is addressed. In this context an analysis of the interaction between the POIn50 solder and the gold coating is presented. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Lead-Free Solders in IC Manufacture: A Review

Loading next page...
 
/lp/springer_journal/lead-free-solders-in-ic-manufacture-a-review-HkJPx9lfWU
Publisher
Kluwer Academic Publishers-Plenum Publishers
Copyright
Copyright © 2003 by MAIK Nauka/Interperiodica
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1023/A:1024579616706
Publisher site
See Article on Publisher Site

Abstract

The compositions and melting points of lead-free solders suitable for IC packaging are given. The use of tin–bismuth alloys for both this purpose and the corrosion protection of packages is outlined. An investigation is described into the dissolution of 0.04-mm-thick gold wire in the POIn50 tin–indium solder in the molten or solid state. In the former case the process is examined as a function of solder temperature and the contact time between the molten solder and the wire. In the latter case, dissolution kinetics is studied at 100°C. The soldering of gold-coated hybrid-IC substrates, including microwave ones, to metal bases is addressed. In this context an analysis of the interaction between the POIn50 solder and the gold coating is presented.

Journal

Russian MicroelectronicsSpringer Journals

Published: Oct 11, 2004

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 12 million articles from more than
10,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Unlimited reading

Read as many articles as you need. Full articles with original layout, charts and figures. Read online, from anywhere.

Stay up to date

Keep up with your field with Personalized Recommendations and Follow Journals to get automatic updates.

Organize your research

It’s easy to organize your research with our built-in tools.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve Freelancer

DeepDyve Pro

Price
FREE
$49/month

$360/year
Save searches from
Google Scholar,
PubMed
Create lists to
organize your research
Export lists, citations
Read DeepDyve articles
Abstract access only
Unlimited access to over
18 million full-text articles
Print
20 pages/month
PDF Discount
20% off