The compositions and melting points of lead-free solders suitable for IC packaging are given. The use of tin–bismuth alloys for both this purpose and the corrosion protection of packages is outlined. An investigation is described into the dissolution of 0.04-mm-thick gold wire in the POIn50 tin–indium solder in the molten or solid state. In the former case the process is examined as a function of solder temperature and the contact time between the molten solder and the wire. In the latter case, dissolution kinetics is studied at 100°C. The soldering of gold-coated hybrid-IC substrates, including microwave ones, to metal bases is addressed. In this context an analysis of the interaction between the POIn50 solder and the gold coating is presented.
Russian Microelectronics – Springer Journals
Published: Oct 11, 2004
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