Information of lead-free solder compositions and melting points, which can be used in the assembly procedures of microelectronic assemblies (parts), is given. Coatings of dies and package bodies for lead-free soldering are considered. The features of lead-free soldering of dies are analyzed in terms of documentations as well as the procedures and modes of soldering of silicon dies to package bodies are considered.
Russian Microelectronics – Springer Journals
Published: Sep 19, 2009
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