ISSN 1070-4272, Russian Journal of Applied Chemistry, 2007, Vol. 80, No. 10, pp. 1721!1723. + Pleiades Publishing, Ltd., 2007.
Original Russian Text + N.I. Polezhaeva, A.A. Nefedov, 2007, published in Zhurnal Prikladnoi Khimii, 2007, Vol. 80, No. 10, pp. 1692!1694.
AND POLYMERIC MATERIALS
Kinetics of Thermal Oxidative Degradation
of a Compound Based on a Polyester Resin
and Dimethylethylphenylammonium Iodide
N. I. Polezhaeva and A. A. Nefedov
Siberian State University of Technology, Krasnoyarsk, Russia
Received October 30, 2006; in final form, January 2007
Abstract-The kinetics of thermal oxidative degradation of a compound based on a polyester resin and
dimethylethylphenylammonium iodide was studied. The rate constants of thermal decomposition were de-
termined. The degradation of the compound was studied by dynamic thermogravimetric analysis.
To develop various formulations of low-tempera-
ture solder creams, taking into account specific con-
ditions of their application, it is necessary to know
how materials used as an organic binder behave at
working temperatures of solder cream fusion. In par-
ticular, the rate of their decomposition at working
temperatures should be evaluated .
This paper reports on a further study of the de-
veloped formulations of low-temperature noncorrosive
solder creams based on a polyester resin modified
with rosin and on quaternary ammonium salts [2, 3].
The parameters of thermal oxidative degradation
of dimethylethylphenylammonium iodide (DMEPAI)
and a compound based on a polyester resin and
DMEPAI were determined by dynamic thermogravi-
metric analysis . To determine more accurately
the temperature at which the samples start to degrade,
we recorded the DTG and DTA curves along with
the TG curve (Figs. 1a, 1b). Measurements were
performed with an MOM Q-1000 derivatograph (Hun-
Fig. 1. Thermograms of (a) dimethylethylphenylammonium iodide and (b) compound based on a polyester resin and
dimethylethylphenylammonium iodide. (Dm/m) Relative weight loss and (T ) temperature.