Diffusion of implanted Sb and As in silicon layers with various contents of radiation defects is investigated during furnace thermal annealing and rapid thermal annealing (RTA). The defect concentration was varied by the additional introduction of Si+ ions. As the defect concentration in the layer increases, the antimony diffusivity increases both during lamp annealing and during furnace thermal annealing, which is governed by diffusion over excess vacancies. The As diffusivity increases with an increase in the concentration of radiation defects in the layer during the lamp annealing and decreases during furnace thermal annealing. The increase in the As diffusivity during RTA is attributed to interstitial Si atoms. The observed decrease in the As diffusivity is caused by the impurity capture by excess vacancies as the traps. However, at defect concentrations much higher than the impurity concentration, the As diffusivity increases but remains substantially lower than the intrinsic value. It follows from the results that the rate of intrinsic As diffusion along the interstitial channel is higher than along the vacancy channel.
Russian Microelectronics – Springer Journals
Published: Mar 28, 2012
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