Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints

Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints The use of functional additives in the electroplating process results in an impurity incorporation in the Cu plated layer. A high level of impurity residual has been recognized as a severe reliability problem to the Sn/Cu joints because voids are prone to form at the Sn/Cu interface in the thermal aging process. This study focuses on the effect of aging temperature on the formation and distribution of voids. Two electroplated Cu substrates and one rolled Cu foil were joined Sn balls to prepare the Sn/Cu joints for thermal aging in the range of 100–200 °C. The microstructural examination results indicated that the additive formula of polyethylene glycol (PEG) and Cl resulted in massive void formation at the Sn/Cu interface, and the distribution of voids showed a strong dependence on the aging temperature. The strong temperature dependence of void distribution led to an unusual evolution of microstructure and shear strength in the Sn/Cu joints. 1 Introduction (disulfide) and attracting the Cu ions in the plating solution using its terminal anion group (sulfonic acid) [7–9]. Cu electroplating is a mature technique that has been widely Sn-bearing solders are the most common joining materi- applied in many technological fields such as surface decora- http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Materials Science: Materials in Electronics Springer Journals

Impurity-induced unusual microstructural evolution and mechanical property in Sn/Cu solder joints

Loading next page...
 
/lp/springer_journal/impurity-induced-unusual-microstructural-evolution-and-mechanical-inOhuWJHrQ
Publisher
Springer US
Copyright
Copyright © 2018 by Springer Science+Business Media, LLC, part of Springer Nature
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials
ISSN
0957-4522
eISSN
1573-482X
D.O.I.
10.1007/s10854-018-9403-7
Publisher site
See Article on Publisher Site

Abstract

The use of functional additives in the electroplating process results in an impurity incorporation in the Cu plated layer. A high level of impurity residual has been recognized as a severe reliability problem to the Sn/Cu joints because voids are prone to form at the Sn/Cu interface in the thermal aging process. This study focuses on the effect of aging temperature on the formation and distribution of voids. Two electroplated Cu substrates and one rolled Cu foil were joined Sn balls to prepare the Sn/Cu joints for thermal aging in the range of 100–200 °C. The microstructural examination results indicated that the additive formula of polyethylene glycol (PEG) and Cl resulted in massive void formation at the Sn/Cu interface, and the distribution of voids showed a strong dependence on the aging temperature. The strong temperature dependence of void distribution led to an unusual evolution of microstructure and shear strength in the Sn/Cu joints. 1 Introduction (disulfide) and attracting the Cu ions in the plating solution using its terminal anion group (sulfonic acid) [7–9]. Cu electroplating is a mature technique that has been widely Sn-bearing solders are the most common joining materi- applied in many technological fields such as surface decora-

Journal

Journal of Materials Science: Materials in ElectronicsSpringer Journals

Published: Jun 4, 2018

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create lists to
organize your research

Export lists, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off