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Heat-Conductivity Studies of Structural Ceramic Materials. Part VII. Heat Conductivity of an Si3N4-Based Ceramic

Heat-Conductivity Studies of Structural Ceramic Materials. Part VII. Heat Conductivity of an... The heat conductivity of an Si3N4-based ceramic is studied. A sintered silicon carbide, prepared from ultrafine (0.5 μm) powder Si3N4 with aluminum and yttrium oxides added to form a liquid phase and thus to activate the sintering process, is used for the study. The Si3N4-based ceramic has a heat conductivity higher than that of an oxide-based ceramic. The approximation function for heat conductivity at temperatures below 1400 K has a negative slope, that is, the effective heat conductivity tends to decrease with temperature. Above 1400 K, the effective heat conductivity tends to increase. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Refractories and Industrial Ceramics Springer Journals

Heat-Conductivity Studies of Structural Ceramic Materials. Part VII. Heat Conductivity of an Si3N4-Based Ceramic

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References (1)

Publisher
Springer Journals
Copyright
Copyright © 2001 by Plenum Publishing Corporation
Subject
Materials Science; Characterization and Evaluation of Materials; Materials Science, general; Ceramics, Glass, Composites, Natural Materials
ISSN
1083-4877
eISSN
1573-9139
DOI
10.1023/A:1014062412069
Publisher site
See Article on Publisher Site

Abstract

The heat conductivity of an Si3N4-based ceramic is studied. A sintered silicon carbide, prepared from ultrafine (0.5 μm) powder Si3N4 with aluminum and yttrium oxides added to form a liquid phase and thus to activate the sintering process, is used for the study. The Si3N4-based ceramic has a heat conductivity higher than that of an oxide-based ceramic. The approximation function for heat conductivity at temperatures below 1400 K has a negative slope, that is, the effective heat conductivity tends to decrease with temperature. Above 1400 K, the effective heat conductivity tends to increase.

Journal

Refractories and Industrial Ceramics – Springer Journals

Published: Oct 9, 2004

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