Growth oxygen-containing defects in silicon grown in a weak vertical magnetic field

Growth oxygen-containing defects in silicon grown in a weak vertical magnetic field Properties of silicon (M-Si) prepared by the Czochralski growth technique in a vertical magnetic field of 0.05 T applied to a melt are studied by measuring IR absorption spectra, microindentation, and selective etching. The effect of increasing the concentration of interstitial oxygen upon the thermal treatment of M-Si is found. It is shown that microhardness of M-Si is higher than that of silicon grown by the traditional Czochralski technique by ∼8%. The features in the behavior of M-Si are attributed to the formation of oxygen-containing defect-impurity complexes during the growth. Upon thermal treatment at 900°C in the hydrogen flow, these complexes decompose with the extraction of interstitial oxygen, which suppresses thermal hardening typical of the silicon single crystals grown by the traditional Czochralski technique. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Growth oxygen-containing defects in silicon grown in a weak vertical magnetic field

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Publisher
SP MAIK Nauka/Interperiodica
Copyright
Copyright © 2011 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739711040044
Publisher site
See Article on Publisher Site

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