The kinetics of curing of an epoxy-amine compound by the polymerization mechanism were studied at various temperatures by isothermal calorimetry and rheokinetic procedures. The resulting kinetic data were correlated with the patterns of variation of the adhesion strength of glass-epoxy-amine compound-glass glue joints, of shrinkage stresses, and shrinkage defects, as well as with the nature of the glue joint failure.
Russian Journal of Applied Chemistry – Springer Journals
Published: Oct 3, 2004
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