Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current

Failure behavior of flip chip solder joint under coupling condition of thermal cycling and... In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Materials Science: Materials in Electronics Springer Journals

Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current

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Publisher
Springer Journals
Copyright
Copyright © 2017 by Springer Science+Business Media, LLC, part of Springer Nature
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials
ISSN
0957-4522
eISSN
1573-482X
D.O.I.
10.1007/s10854-017-8464-3
Publisher site
See Article on Publisher Site

Abstract

In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.

Journal

Journal of Materials Science: Materials in ElectronicsSpringer Journals

Published: Dec 27, 2017

References

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