Estimating the reliability of aluminum metallization of integrated circuits by accelerated electromigration testing at constant temperature

Estimating the reliability of aluminum metallization of integrated circuits by accelerated... A technique for estimating the reliability of multilayer metallization of integrated circuits at constant temperature has been implemented and tested. Statistical processing of the data has been carried out and the main reliability parameters of conductors have been calculated. The main types of failure, which commonly arise upon electromigration testing at constant temperature, have been demonstrated and analyzed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Estimating the reliability of aluminum metallization of integrated circuits by accelerated electromigration testing at constant temperature

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Publisher
Pleiades Publishing
Copyright
Copyright © 2015 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739715070148
Publisher site
See Article on Publisher Site

Abstract

A technique for estimating the reliability of multilayer metallization of integrated circuits at constant temperature has been implemented and tested. Statistical processing of the data has been carried out and the main reliability parameters of conductors have been calculated. The main types of failure, which commonly arise upon electromigration testing at constant temperature, have been demonstrated and analyzed.

Journal

Russian MicroelectronicsSpringer Journals

Published: Nov 14, 2015

References

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