Erratum to: Active thermal management of on-chip hot spots using EWOD-driven droplet microfluidics

Erratum to: Active thermal management of on-chip hot spots using EWOD-driven droplet microfluidics Exp Fluids (2010) 49:1393 DOI 10.1007/s00348-010-0982-1 ERRATUM Erratum to: Active thermal management of on-chip hot spots using EWOD-driven droplet microfluidics J.-T. Cheng C.-L. Chen Published online: 29 September 2010 Springer-Verlag 2010 Erratum to: Exp Fluids DOI 10.1007/s00348-010-0882-4 In the original publication the Acknowledgments was incomplete. The full text of the Acknowledgments reads as follows: This work was supported by Rockwell Automation, Inc. and NASA (Contract No. NNC09CA36C). The authors thank L. Lin, D. Taber and B. Wen for EWOD device fabrication, technical assistance, and helpful discussion. The online version of the original article can be found under doi:10.1007/s00348-010-0882-4. J.-T. Cheng (&)  C.-L. Chen Teledyne Scientific Company, 1049 Camino Dos Rios, Thousand Oaks, CA 91360, USA e-mail: jcheng@teledyne-si.com; jiangtao.cheng@gmail.com http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Experiments in Fluids Springer Journals

Erratum to: Active thermal management of on-chip hot spots using EWOD-driven droplet microfluidics

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Publisher
Springer-Verlag
Copyright
Copyright © 2010 by Springer-Verlag
Subject
Engineering; Engineering Thermodynamics, Heat and Mass Transfer; Fluid- and Aerodynamics; Engineering Fluid Dynamics
ISSN
0723-4864
eISSN
1432-1114
D.O.I.
10.1007/s00348-010-0982-1
Publisher site
See Article on Publisher Site

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