Enhancing the dry-etch durability of photoresist masks: A review of the main approaches

Enhancing the dry-etch durability of photoresist masks: A review of the main approaches A review is presented of the main approaches to the enhancement of photoresist-mask durability under dry etching. The physical and chemical processes involved are described. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Enhancing the dry-etch durability of photoresist masks: A review of the main approaches

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Publisher
Nauka/Interperiodica
Copyright
Copyright © 2007 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739707010052
Publisher site
See Article on Publisher Site

Abstract

A review is presented of the main approaches to the enhancement of photoresist-mask durability under dry etching. The physical and chemical processes involved are described.

Journal

Russian MicroelectronicsSpringer Journals

Published: Feb 1, 2007

References

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