Electrode geometry as dependent on electrolyte temperature in thick Cu film electrodeposition for making tunnel multilayer structures

Electrode geometry as dependent on electrolyte temperature in thick Cu film electrodeposition for... An experimental investigation is presented into the magnitude and sign of nonflatness for Ag/Cu electrodes obtained by splitting a Si/Ti/Ag/Cu stack produced by Cu electrodeposition. The characteristic is considered in relation to electrolyte temperature. The contact area between a Si/Ti and a Ag/Cu electrode is estimated. The conformality of the two electrode surfaces is essential for creating tunnel-effect thermoelectric coolers and power generators with a vacuum nanogap, promising power supplies that make use of electron tunneling. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Electrode geometry as dependent on electrolyte temperature in thick Cu film electrodeposition for making tunnel multilayer structures

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Publisher
SP MAIK Nauka/Interperiodica
Copyright
Copyright © 2008 by MAIK Nauka
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739708050053
Publisher site
See Article on Publisher Site

Abstract

An experimental investigation is presented into the magnitude and sign of nonflatness for Ag/Cu electrodes obtained by splitting a Si/Ti/Ag/Cu stack produced by Cu electrodeposition. The characteristic is considered in relation to electrolyte temperature. The contact area between a Si/Ti and a Ag/Cu electrode is estimated. The conformality of the two electrode surfaces is essential for creating tunnel-effect thermoelectric coolers and power generators with a vacuum nanogap, promising power supplies that make use of electron tunneling.

Journal

Russian MicroelectronicsSpringer Journals

Published: Sep 21, 2008

References

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