An experimental investigation is presented into the magnitude and sign of nonflatness for Ag/Cu electrodes obtained by splitting a Si/Ti/Ag/Cu stack produced by Cu electrodeposition. The characteristic is considered in relation to electrolyte temperature. The contact area between a Si/Ti and a Ag/Cu electrode is estimated. The conformality of the two electrode surfaces is essential for creating tunnel-effect thermoelectric coolers and power generators with a vacuum nanogap, promising power supplies that make use of electron tunneling.
Russian Microelectronics – Springer Journals
Published: Sep 21, 2008
It’s your single place to instantly
discover and read the research
that matters to you.
Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.
All for just $49/month
Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly
Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.
All the latest content is available, no embargo periods.
“Whoa! It’s like Spotify but for academic articles.”@Phil_Robichaud