Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn–Ag–Cu alloy

Effects of Dy substitution for Sn on the solderability and mechanical property of the standard... In this study, the solderability of Sn–3.5Ag–0.5Cu–xDy solders were investigated and the shear strength properties of joints with Cu substrate were investigated. The results indicated that a small amount Dy addition can improve the solderability, and the optimal amount of Dy was 0.025 wt%. The maximum shear strength can be found with 0.025 wt% Dy addition, improved by 74%. With the observation of the fracture morphology, it was found that a small amount Dy can improve the ductility of the solder joints; but excessive amount of Dy would deteriorate the shear strength and form large dimples on the fracture surface. 1 Introduction In order to further enhance the properties of Sn–Ag–Cu solders, adding the forth element is a means of improving The toxic nature of lead has prompted the implementing both physical and mechanical properties. It is well-known of environmental directives and has also accelerated the that there are two groups of rare earth elements (REs). One research and application of lead-free solders [1, 2]. At pre- is called light REs (La, Ce, Pr, Nd, Pm, Sm, Eu), and the sent, lead-free solders have been widely used in electronic other one is called heavy REs (Gd, Tb, Dy, Ho, Er, Tm, http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Materials Science: Materials in Electronics Springer Journals

Effects of Dy substitution for Sn on the solderability and mechanical property of the standard near eutectic Sn–Ag–Cu alloy

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Publisher
Springer US
Copyright
Copyright © 2018 by Springer Science+Business Media, LLC, part of Springer Nature
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials
ISSN
0957-4522
eISSN
1573-482X
D.O.I.
10.1007/s10854-018-9383-7
Publisher site
See Article on Publisher Site

Abstract

In this study, the solderability of Sn–3.5Ag–0.5Cu–xDy solders were investigated and the shear strength properties of joints with Cu substrate were investigated. The results indicated that a small amount Dy addition can improve the solderability, and the optimal amount of Dy was 0.025 wt%. The maximum shear strength can be found with 0.025 wt% Dy addition, improved by 74%. With the observation of the fracture morphology, it was found that a small amount Dy can improve the ductility of the solder joints; but excessive amount of Dy would deteriorate the shear strength and form large dimples on the fracture surface. 1 Introduction In order to further enhance the properties of Sn–Ag–Cu solders, adding the forth element is a means of improving The toxic nature of lead has prompted the implementing both physical and mechanical properties. It is well-known of environmental directives and has also accelerated the that there are two groups of rare earth elements (REs). One research and application of lead-free solders [1, 2]. At pre- is called light REs (La, Ce, Pr, Nd, Pm, Sm, Eu), and the sent, lead-free solders have been widely used in electronic other one is called heavy REs (Gd, Tb, Dy, Ho, Er, Tm,

Journal

Journal of Materials Science: Materials in ElectronicsSpringer Journals

Published: May 30, 2018

References

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