The effect of Zn content on Cu–Ni cross-interaction in Cu/Sn–xZn/Ni (x = 1, 5, 9) micro solder joints during reflow at 250 °C was investigated. The cross-sectional microstructure, top-view morphology and phase composition of interfacial intermetallic compounds (IMCs) were examined to reveal IMC evolution. At the Ni side, Cu–Ni cross-interaction occurs in all the solder joints. However, the Cu–Ni cross-interaction is obviously weakened when the Zn content is higher than 5 wt% by forming Ni5Zn21-type or Ni3Sn4-type IMCs instead of Cu6Sn5-type IMC which is a typical reaction product under Cu–Ni cross-interaction. At the Cu side, Cu–Ni cross-interaction occurs in all the Cu/Sn–1Zn/Ni solder joints and the Cu/Sn–5Zn/Ni and Cu/Sn–9Zn/Ni solder joints after the initial Cu5Zn8-type IMC transforms into CuZn-type IMC. Zn can strongly retarded the Cu–Ni cross-interaction by dominating interfacial reaction. The reaction path at each interface is discussed based on the Sn-rich corner of Sn–Zn–Cu, Sn–Zn–Ni and Sn–Ni–Cu ternary isotherms.
Journal of Materials Science: Materials in Electronics – Springer Journals
Published: Jan 8, 2018
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