Access the full text.
Sign up today, get DeepDyve free for 14 days.
J. Drelich (2002)
MEASUREMENT OF INTERFACIAL TENSION IN FLUID-FLUID SYSTEMS
(2012)
Surface Properties and Wetting Behaviour of Liquid Ag-Sb-Sn Alloys, J
Jou-i Lee, Sinn-wen Chen, Hsiu-yu Chang, Chih-ming Chen (2003)
Reactive wetting between molten Sn-Bi and Ni substrateJournal of Electronic Materials, 32
(2006)
Mechanical and Microstructural Properties of SnAgCu Solder Joints, Mater
M. Arenas, V. Acoff (2004)
Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substratesJournal of Electronic Materials, 33
(2004)
Surface Tension and its Temperature Coefficient of Liquid Sn_X (X = Ag, Cu) Alloys, Mater
Guiwu Liu, F. Valenza, M. Muolo, G. Qiao, A. Passerone (2009)
Wetting and interfacial behavior of Ni–Si alloy on different substratesJournal of Materials Science, 44
Chien Lin, Kwang-Lung Lin (2003)
Contact angle of 63Sn-37Pb and Pb-free solder on Cu platingApplied Surface Science, 214
Toshihiro Tanaka, K. Hack, T. Iida, S. Hara (1996)
Application of Thermodynamic Databases to the Evaluation of Surface Tensions of Molten Alloys, Salt Mixtures and Oxide MixturesInternational Journal of Materials Research, 87
A. Zdziennicka, K. Szymczyk, J. Krawczyk, B. Jańczuk (2017)
Some remarks on the solid surface tension determination from contact angle measurementsApplied Surface Science, 405
D. Bonn, J. Eggers, J. Indekeu, J. Meunier, E. Rolley (2009)
Wetting and SpreadingReviews of Modern Physics, 81
Titus Chellaih, G. Kumar, K. Prabhu (2007)
Effect of thermal contact heat transfer on solidification of Pb–Sn and Pb-free soldersMaterials & Design, 28
(2011)
Wetting and Surface Forces, J
Z. Moser, W. Gasior, A. Dębski, J. Pstruś (2007)
Surdat: Database of physical properties of lead-free soldersJournal of Mining and Metallurgy, Section B, 43
Aaas News, E. Lu, Min-Min Zhou, Rong Mocsai, A. Myers, E. Huang, B. Jackson, Davide Ferrari, V. Tybulewicz, V. Lowell, Clifford Lepore, J. Koretzky, Gary Kahn, M. L., F. Achard, H. Eva, Ernst-Detlef Schulze, J. Acharya, U. Acharya, U. Acharya, Shetal Patel, E. Koundakjian, K. Nagashima, Xianlin Han, J. Acharya, D. Adams, Jonathan Horton, Blood, M. Adams, M. McVey, J. Sekelsky, J. Adamson, G. Kochendoerfer, A. Adeleke, A. Kamdem-Toham, Alan Aderem, C. Picard, Aeschlimann, G. Haug, G. Agarwal, M. Scully, H. Aguilaniu, L. Gustafsson, M. Rigoulet, T. Nyström, Asymmetric Inheri, Ferhaan Ahmad, J. Schmitt, M. Aida, S. Ammal, J. Aizenberg, D. Muller, J. Grazul, D. Hamann, J. Ajioka, C. Su, A. Akella, M. Alam, F. Gao, A. Alatas, H. Sinn, Titus Albu, P. Zuev, M. Al-Dayeh, J. Dwyer, A. Al-ghonaium, Sami Al-Hajjar, S. Al-Jumaah, A. Allakhverdov, V. Pokrovsky, Allen, A. Brown, James Allen, A. Brown, James Gillooly, James (1893)
Book ReviewsBuffalo Medical and Surgical Journal, 33
J. Sundelin, S. Nurmi, T. Lepistö, E. Ristolainen (2006)
Mechanical and microstructural properties of SnAgCu solder jointsMaterials Science and Engineering A-structural Materials Properties Microstructure and Processing, 420
C. Gonçalves, H. Leitão, C. Lau, J. Teixeira, L. Ribas, S. Teixeira, M. Cerqueira, F. Macedo, D. Soares (2015)
Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphereJournal of Materials Science: Materials in Electronics, 26
N. Eustathopoulos, M. Nicholas, B. Drevet (1999)
Wettability at high temperatures
K. Suganuma (2001)
Advances in lead-free electronics solderingCurrent Opinion in Solid State & Materials Science, 5
JC Bashforth, F Adams (1892)
An Attempt to Test the Theory of Capillary Action
(2009)
and T
T Tanaka, K Hack, T Lida, S Hara (1996)
Application of Thermodynamic Databases to the Evaluation of Surface Tensions of Molten Alloys, Salt Mixtures and Oxide MixturesZ. Metall., 875
KN Prabhu (2011)
87Adv. Colloid Interface Sci., 166
Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, C. Shur, Seung-Boo Jung (2009)
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder jointsJournal of Alloys and Compounds, 486
F. Gnecco, E. Ricci, S. Amore, D. Giuranno, G. Borzone, G. Zanicchi, R. Novakovic (2007)
Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substratesInternational Journal of Adhesion and Adhesives, 27
Liang Zhang, S. Xue, G. Zeng, Li-li Gao, Huan Ye (2012)
Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal agingJournal of Alloys and Compounds, 510
O. Dezellus, N. Eustathopoulos (2010)
Fundamental issues of reactive wetting by liquid metalsJournal of Materials Science, 45
N. Sobczak, A. Kudyba, R. Nowak, Waldemar Radziwill, K. Pietrzak (2007)
Factors affecting wettability and bond strength of solder joint couplesPure and Applied Chemistry, 79
A. Senz, H. Gsponer (1994)
Micellar Binding of Phenoxide Ions to Cetyltrimethylammonium Chloride (CTAC), 165
Joon-Ho Lee, Wataru Shimoda, Toshihiro Tanaka (2004)
Surface Tension and its Temperature Coefficient of Liquid Sn-X (X=Ag, Cu) AlloysMaterials Transactions, 45
Z Moser, W Gasior, A Debski, J Pstrus (2007)
SURDAT—Database of Physical Properties of Lead-Free SoldersJ. Min. Metall. Sect. B Metall., 43
(2009)
Reliability of LeadFree Solder Interconnections in Thermal and Power Cycling Tests, IEEE Trans
JD Malcolm, DD Elliot (1980)
Interfacial Tension from Height and Diameter of a Single Sessile Drop or Captive BubbleJ. Chem. Eng., 58
L. Zang, Zhangfu Yuan, Hongyan Xu, Bing-sheng Xu (2011)
Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503 K to 673 KApplied Surface Science, 257
O. Rio, A. Neumann (1997)
Axisymmetric Drop Shape Analysis: Computational Methods for the Measurement of Interfacial Properties from the Shape and Dimensions of Pendant and Sessile Drops.Journal of colloid and interface science, 196 2
Jue Li, J. Karppinen, Tomi Laurila, J. Kivilahti (2009)
Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling TestsIEEE Transactions on Components and Packaging Technologies, 32
Hongtao Han (2012)
Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigue, 25
R. Voitovich, A. Mortensen, N. Eustathopoulos (1999)
Spreading Kinetics of Cu-Cr Alloys on Carbon Substrates
Satyanarayan, K. Prabhu (2011)
Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.Advances in colloid and interface science, 166 1-2
K. Kanlayasiri, M. Mongkolwongrojn, T. Ariga (2009)
Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloyJournal of Alloys and Compounds, 485
L. Boinovich, A. Emelyanenko (2011)
Wetting and surface forces.Advances in colloid and interface science, 165 2
R Voitovitch, A Mortensen, F Hodaj, N Eustathopoulos (1999)
Diffusion-Limited Reactive Wetting: Study of Spreading Kinetics of Cu-Cr Alloys on CarbonActa Mater., 47
J. Görlich, C. Oberdorfer, D. Baither, G. Schmitz, C. Reinke, U. Wilke (2010)
The role of oxide layers in solder jointsJournal of Alloys and Compounds, 490
(1999)
Modelling Reative Wetting
S. Amore, E. Ricci, G. Borzone, R. Novakovic (2008)
Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substratesMaterials Science and Engineering A-structural Materials Properties Microstructure and Processing, 495
H. Tavana, A. Neumann (2007)
Recent progress in the determination of solid surface tensions from contact angles.Advances in colloid and interface science, 132 1
T. Gancarz (2017)
Density, surface tension and viscosity of Ga-Sn alloysJournal of Molecular Liquids, 241
L. Zang, Zhangfu Yuan, Hong-xin Zhao, Xiaorui Zhang (2009)
Wettability of molten Sn–Bi–Cu solder on Cu substrateMaterials Letters, 63
V. Sklyarchuk, Yu. Plevachuka, I. Kaban, R. Novakovic (2012)
Surface properties and wetting behavior of liquid Ag-Sb-Sn alloysJournal of Mining and Metallurgy, Section B, 48
T. Hetschel, K. Wolter, F. Phillipp (2008)
Wettability effects of immersion tin final finishes with lead free solder2008 2nd Electronics System-Integration Technology Conference
(2009)
Wetting and Spreading, Rev
P. Protsenko, A. Terlain, V. Traskine, N. Eustathopoulos (2001)
The role of intermetallics in wetting in metallic systemsScripta Materialia, 45
C. Leinenbach, F. Valenza, D. Giuranno, H. Elsener, S. Jin, R. Novakovic (2011)
Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni SubstratesJournal of Electronic Materials, 40
G. Humpston, D. Jacobson (2004)
Principles of Soldering
F. Guo, S. Choi, J. Lucas, K. Subramanian (2000)
Effects of reflow on wettability, microstructure and mechanical properties in lead-free soldersJournal of Electronic Materials, 29
V. Vuorinen, T. Laurila, Hao Yu, J. Kivilahti (2006)
Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishesJournal of Applied Physics, 99
Ervina Noor, N. Sharif, C. Yew, T. Ariga, A. Ismail, Zuhailawati Hussain (2010)
Wettability and strength of In–Bi–Sn lead-free solder alloy on copper substrateJournal of Alloys and Compounds, 507
J. Warren, W. Boettinger, A. Roosen (1998)
Modeling reactive wettingActa Materialia, 46
M. Ramirez, L. Henneken, S. Virtanen (2011)
Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solderApplied Surface Science, 257
J. Malcolm, C. Elliott (1980)
Interfacial tension from height and diameter of a single sessile drop or captive bubbleCanadian Journal of Chemical Engineering, 58
(1999)
and N
(1998)
Roosen, Modelling Reative Wetting
C Gonçalves (2015)
5106J. Mater. Sci.: Mater. Electron., 26
V. López, A. Kennedy (2006)
Flux-assisted wetting and spreading of Al on TiC.Journal of colloid and interface science, 298 1
The “degree of wetting,” which is related to the contact angle (θ) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface finish and used atmosphere (inert or non-inert). Furthermore, the surface tension, being an important parameter on the solderability process and performance, can also be achieved if the contact angle is known. In this study, the SAC405 [Sn4.0Ag0.5Cu (in wt.%)] solder paste contact angle was measured, by the “sessile drop” method, as a function of the temperature, surface pad finish and used atmosphere. The results are discussed, and the contact angles obtained for the different conditions are compared and discussed. Then, the surface tension (experimental) was obtained from the measured contact angle and compared with the obtained by using computation models (theoretical). The experiments performed in high vacuum conditions, i.e., low oxygen content, over a temperature range, allowed the evaluation and understanding of the surface oxides layers role on the solder wettability. The present study shows that in the soldering process, even in an inert atmosphere, usually used in industry, occurs the formation of superficial oxides, over the liquid solder and/or at the pad surfaces, that strongly affects the solder paste wettability, specially with Sn and OSP (organic solderability preservative) finishing. Differences in contact angle of ≥ 10° were determined between the two types of used atmospheres. The experimental surface tension and theoretical surface tension obtained, for the NiAu substrate type, present good correlation. The lower contact angle values were obtained for the NiAu and OSP finish types, independently of the atmosphere type.
Journal of Materials Engineering and Performance – Springer Journals
Published: May 29, 2018
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.