JMEPEG ASM International https://doi.org/10.1007/s11665-018-3419-2 1059-9495/$19.00 Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates D. Soares, H. Leita˜ o, C.S. Lau, J.C. Teixeira, L. Ribas, R. Alves, S. Teixeira, M.F. Cerqueira, and F. Macedo (Submitted October 24, 2017; in revised form March 27, 2018) The ‘‘degree of wetting,’’ which is related to the contact angle (h) between the molten solder and the substrate, is a useful parameter on the solderability process control. The contact angle, however, is strongly dependent on the type of substrate surface ﬁnish and used atmosphere (inert or non-inert). Furthermore, the surface tension, being an important parameter on the solderability process and performance, can also be achieved if the contact angle is known. In this study, the SAC405 [Sn4.0Ag0.5Cu (in wt.%)] solder paste contact angle was measured, by the ‘‘sessile drop’’ method, as a function of the temperature, surface pad ﬁnish and used atmosphere. The results are discussed, and the contact angles obtained for the different conditions are compared and discussed. Then, the surface tension (experimental) was obtained from the measured contact angle and compared with the obtained by using computation models (theoretical). The experiments performed in
Journal of Materials Engineering and Performance – Springer Journals
Published: May 29, 2018
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