Digital-Reflectometry Characterization of the Surface Structure and Protective Property of Thin Films

Digital-Reflectometry Characterization of the Surface Structure and Protective Property of Thin... A method is presented for the fast nondestructive inspection of oxide-thickness distribution over a small site of interest on a metal or semiconductor specimen. The method rests on specular reflectometry and is incorporated in a computer-based video microscope. From digital images of small sites, statistical characteristics of the thickness distribution are derived and local topographical images of the film surface are generated using three-dimensional computer graphics. A relationship is established between these data and the protective property of the oxide against corrosion. The practical value of the approach is confirmed by experiment. The experimental data indicate that the instrument and technique employed can accurately quantify the uniformity of thickness distribution. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Digital-Reflectometry Characterization of the Surface Structure and Protective Property of Thin Films

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Publisher
Kluwer Academic Publishers-Plenum Publishers
Copyright
Copyright © 2002 by MAIK "Nauka/Interperiodica"
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1023/A:1020938010452
Publisher site
See Article on Publisher Site

Abstract

A method is presented for the fast nondestructive inspection of oxide-thickness distribution over a small site of interest on a metal or semiconductor specimen. The method rests on specular reflectometry and is incorporated in a computer-based video microscope. From digital images of small sites, statistical characteristics of the thickness distribution are derived and local topographical images of the film surface are generated using three-dimensional computer graphics. A relationship is established between these data and the protective property of the oxide against corrosion. The practical value of the approach is confirmed by experiment. The experimental data indicate that the instrument and technique employed can accurately quantify the uniformity of thickness distribution.

Journal

Russian MicroelectronicsSpringer Journals

Published: Oct 13, 2004

References

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