Correction to: Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb

Correction to: Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally... Journal of ELECTRONIC MATERIALS, Vol. 47, No. 7, 2018 https://doi.org/10.1007/s11664-018-6242-5 2018 The Minerals, Metals & Materials Society CORRECTION Correction to: Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb 1,2 1 1 1 ZHANMIN CAO, WEI XIE, KUNPENG WANG, GUANGWEI DU, and ZHIYU QIAO 1.—State Key Laboratory of Advanced Metallurgy, School of Metallurgical and Ecological Engineering, University of Science and Technology Beijing, Beijing 100083, China. 2.—e-mail: zmcao@ustb.edu.cn Correction to: Journal of ELECTRONIC MATERIALS, https://doi.org/10.1007/s11664-013-2599-7 In the original article, there are three errors in the parameters listed under x(NiIn): (Ni, Va) (In, 0.5 Ni) in Table II. The corrected parameters are as 0.5 follows: Tetragonal A6 0 x 0 G ¼ 21518:18  11:5225T þ 0:5 G Va:In In 0 x L ¼36696:83 þ 18:568595T Ni;Va:In 1 x L ¼22748:13 þ 29:58067T Ni;Va:In (published online March 26, 2018) The original article can be found online at https://doi.org/10.1007/ s11664-013-2599-7. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Electronic Materials Springer Journals

Correction to: Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb

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Publisher
Springer US
Copyright
Copyright © 2018 by The Minerals, Metals & Materials Society
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics
ISSN
0361-5235
eISSN
1543-186X
D.O.I.
10.1007/s11664-018-6242-5
Publisher site
See Article on Publisher Site

Abstract

Journal of ELECTRONIC MATERIALS, Vol. 47, No. 7, 2018 https://doi.org/10.1007/s11664-018-6242-5 2018 The Minerals, Metals & Materials Society CORRECTION Correction to: Thermodynamic Assessment of the In-Ni-Sb System and Predictions for Thermally Stable Contacts to InSb 1,2 1 1 1 ZHANMIN CAO, WEI XIE, KUNPENG WANG, GUANGWEI DU, and ZHIYU QIAO 1.—State Key Laboratory of Advanced Metallurgy, School of Metallurgical and Ecological Engineering, University of Science and Technology Beijing, Beijing 100083, China. 2.—e-mail: zmcao@ustb.edu.cn Correction to: Journal of ELECTRONIC MATERIALS, https://doi.org/10.1007/s11664-013-2599-7 In the original article, there are three errors in the parameters listed under x(NiIn): (Ni, Va) (In, 0.5 Ni) in Table II. The corrected parameters are as 0.5 follows: Tetragonal A6 0 x 0 G ¼ 21518:18  11:5225T þ 0:5 G Va:In In 0 x L ¼36696:83 þ 18:568595T Ni;Va:In 1 x L ¼22748:13 þ 29:58067T Ni;Va:In (published online March 26, 2018) The original article can be found online at https://doi.org/10.1007/ s11664-013-2599-7.

Journal

Journal of Electronic MaterialsSpringer Journals

Published: Mar 26, 2018

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