Control of the adhesion strength of thin metal films in multilayer structures

Control of the adhesion strength of thin metal films in multilayer structures Technology of the fabrication of multilayer structures with controllable adhesion interaction between metal films composing these structures is considered. Control of adhesion interaction was attained by modifying the surface of corresponding metal film until an adhesion bond appeared in vacuum and by changing technological parameters. The adhesion strength was evaluated by the temperature of structure splitting due to the difference in the coefficients of thermal expansion of the substrate and ultimate metal electrode. The analysis of surfaces prior to and after structure splitting was carried out optically using the Michelson interferometer. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

Control of the adhesion strength of thin metal films in multilayer structures

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Publisher
Nauka/Interperiodica
Copyright
Copyright © 2007 by Pleiades Publishing, Ltd.
Subject
Engineering; Electronic and Computer Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739707050058
Publisher site
See Article on Publisher Site

Abstract

Technology of the fabrication of multilayer structures with controllable adhesion interaction between metal films composing these structures is considered. Control of adhesion interaction was attained by modifying the surface of corresponding metal film until an adhesion bond appeared in vacuum and by changing technological parameters. The adhesion strength was evaluated by the temperature of structure splitting due to the difference in the coefficients of thermal expansion of the substrate and ultimate metal electrode. The analysis of surfaces prior to and after structure splitting was carried out optically using the Michelson interferometer.

Journal

Russian MicroelectronicsSpringer Journals

Published: Sep 27, 2007

References

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