The design-and-manufacturing features of the development of discrete semiconductor devices and 3D wares are considered. Coatings of contact areas of crystals and package traverses for the formation of internal connections in 3D wares are analyzed. It is established that the following coatings should be primarily considered in assembling 3D wares: aluminum and copper metallization on crystals; and gold, silver, nickel, its alloys, and galvanic aluminizing on the package traverses. The data on the deposition technology of these coatings are presented.
Russian Microelectronics – Springer Journals
Published: Sep 3, 2013
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