Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process

Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process Journal of ELECTRONIC MATERIALS https://doi.org/10.1007/s11664-018-6335-1 2018 The Minerals, Metals & Materials Society Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process 1 2 3 4 HYUNJU LEE, JAEWOOK JUNG, CHEOLHO HEO, CHIHO KIM, 5,6 4,7 JAE-HO LEE, and YANGDO KIM 1.—Department of Mechanical Engineering, Worcester Polytechnic Institute, Worcester, MA 01609, USA. 2.—PLP Technology Group, Samsung Electro-Mechanics, Cheonan 31086, Korea. 3.—ACI Division, Samsung Electro-Mechanics, Busan 46754, Korea. 4.—School of Materials Science and Engineering, Pusan National University, Busan 46241, Korea. 5.—Department of Materials Science and Engineering, Hongik University, Seoul 04066, Korea. 6.—e-mail: jhlee@hongik.ac.kr. 7.—e-mail: yangdo@pusan.ac.kr The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface be- tween the solder and metal pad. Contamination in electroless Ni plating solutions with increasing metal turn over (MTO) is believed to be one of the causes of the formation of surface defects. MTO means indirectly Ni bath life, with ‘‘0 MTO’’ indicating a freshly plating bath and ‘‘2 MTO’’ an aged plating bath, which is supplemented twice with the initial amount of metallic salts and the reducing agent. In this study, surface defects on the Ni-plated layer http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Electronic Materials Springer Journals

Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process

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Publisher
Springer US
Copyright
Copyright © 2018 by The Minerals, Metals & Materials Society
Subject
Materials Science; Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics
ISSN
0361-5235
eISSN
1543-186X
D.O.I.
10.1007/s11664-018-6335-1
Publisher site
See Article on Publisher Site

Abstract

Journal of ELECTRONIC MATERIALS https://doi.org/10.1007/s11664-018-6335-1 2018 The Minerals, Metals & Materials Society Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process 1 2 3 4 HYUNJU LEE, JAEWOOK JUNG, CHEOLHO HEO, CHIHO KIM, 5,6 4,7 JAE-HO LEE, and YANGDO KIM 1.—Department of Mechanical Engineering, Worcester Polytechnic Institute, Worcester, MA 01609, USA. 2.—PLP Technology Group, Samsung Electro-Mechanics, Cheonan 31086, Korea. 3.—ACI Division, Samsung Electro-Mechanics, Busan 46754, Korea. 4.—School of Materials Science and Engineering, Pusan National University, Busan 46241, Korea. 5.—Department of Materials Science and Engineering, Hongik University, Seoul 04066, Korea. 6.—e-mail: jhlee@hongik.ac.kr. 7.—e-mail: yangdo@pusan.ac.kr The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface be- tween the solder and metal pad. Contamination in electroless Ni plating solutions with increasing metal turn over (MTO) is believed to be one of the causes of the formation of surface defects. MTO means indirectly Ni bath life, with ‘‘0 MTO’’ indicating a freshly plating bath and ‘‘2 MTO’’ an aged plating bath, which is supplemented twice with the initial amount of metallic salts and the reducing agent. In this study, surface defects on the Ni-plated layer

Journal

Journal of Electronic MaterialsSpringer Journals

Published: May 30, 2018

References

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