ISSN 10637397, Russian Microelectronics, 2014, Vol. 43, No. 1, pp. 21–33. © Pleiades Publishing, Ltd., 2014.
Original Russian Text © V.V. Zenin, A.A. Stoyanov, S.V. Petrov, S.Yu. Chistyakov, 2014, published in Mikroelektronika, 2014, Vol. 43, No. 1, pp. 29–42.
There currently exist a variety of different 3Dinte
gration methods [1–4]. These methods involve the
following principal operations: the treatment of the
back side of a plate after thinning, the integration of
dies into a stack assembly, and the die–package splic
ing of inner wirings.
Some schemes of the assembly of 3Dwares with
the use of wire leadouts are shown in Fig. 1.
The most critical operation in the technology of the
manufacturing of semiconductor devices, including
3Dwares, is the formation of reliable microwelds,
which determine their troublefree operation. To pro
vide the reliability of contact wirings, it is necessary to
take into account the quality of a microwire/tape, the
metallization of dies and packages, and of the design
and material of a welding tool, as well as the selection
of optimal bonding methods and regimes. At the same
time, it is extremely important to make the correct
choice of the optimal methods for controlling the pro
cess of assembly and the testing of the formed welds,
depending on the applied assembly method and
equipment, when developing the technological pro
cesses of assembly operations.
Assembly of 3DWares with the Use of Wire Leadouts
V. V. Zenin
, A. A. Stoyanov
, S. V. Petrov
, and S. Yu. Chistyakov
Voronezh State Technical University, Moskovskii pr. 14, Voronezh, 394026 Russia
Research Institute of Electronics, ul. Starykh Bol’shevikov 5, Voronezh, 394033 Russia
OAO Voronezh Plant of Semiconductor Devices–Assembly, Leninskii pr. 119a, Voronezh, 394033 Russia
Received August 8, 2012
—Some methods of the formation of microwelds, which are most acceptable for the assembly of
3Dwares with the use of wire leadouts, have been analyzed. Some peculiarities of the bonding of inner wir
ings on a die and a package by different welding methods, such as pressure welding with indirect pulsed heat
ing and thermosonic, ultrasonic, and splittip welding, have been considered. The effect of structural and
technological factors on the quality of microwelds made by ultrasonic welding with the use of aluminum wire,
aluminum metallization on a die, and gold, nickel, and nickel alloy coatings has been studied. Some infor
mation on microwelds made with the use of copper wire and copper metallization has been represented.
Stacked die 3D largescale integrated circuits made by the nonTSV technology with the splicing of leadouts and the fur
ther packaging into a single BGApackage.