Adhesion of polyimide films to microelectronic article components

Adhesion of polyimide films to microelectronic article components Reactions between polypyromellitamido acid and component materials of microelectronic articles were examined by thermogravimetric analysis. Modes of modification of the surfaces of semiconductor structures to be used in formation of a system of interconnections with polyimide as interlayer insulator to obtain a high adhesion between the layers via their chemical reactions. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Journal of Applied Chemistry Springer Journals

Adhesion of polyimide films to microelectronic article components

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Publisher
Springer Journals
Copyright
Copyright © 2006 by Pleiades Publishing, Inc.
Subject
Chemistry; Chemistry/Food Science, general; Industrial Chemistry/Chemical Engineering
ISSN
1070-4272
eISSN
1608-3296
D.O.I.
10.1134/S1070427206100259
Publisher site
See Article on Publisher Site

Abstract

Reactions between polypyromellitamido acid and component materials of microelectronic articles were examined by thermogravimetric analysis. Modes of modification of the surfaces of semiconductor structures to be used in formation of a system of interconnections with polyimide as interlayer insulator to obtain a high adhesion between the layers via their chemical reactions.

Journal

Russian Journal of Applied ChemistrySpringer Journals

Published: Dec 1, 2006

References

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