Keywords Pulse electrodeposition model · Electrochemical additive manufacturing · Inter-electrode gap · High current density nickel deposition Extended author information available on the last page of the article Vol.:(0123456789) 1 3 464 Journal of Applied Electrochemistry (2018) 48:463–469 their alloys [11, 12]. LECD using bipolar electrochemistry 1 Introduction with currents lower than the limiting current region was used to deposit copper on to gold electrodes where second- Additive Manufacturing (AM) is defined as a process of ary current distribution was computed numerically in the joining materials to make parts from 3D model data, usu- study to predict the deposition profile . ally layer upon layer, as opposed to subtractive manufac- Modeling the mass transfer-controlled Nickel electroplat- turing and formative manufacturing methodologies . ing was performed, where the effect of pulsed current on the Parts produced by AM of metals using energy beam-based process was studied theoretically and validated experimen- methods are increasingly being used in the industry for tally with a sensitivity analysis performed to identify the functional applications . However, traditional ther- critical process parameters . Numerical modeling of the mal-based metal additive manufacturing has limitations copper electrodeposition under pulse current conditions was such as residual stress in the parts and
Journal of Applied Electrochemistry – Springer Journals
Published: Feb 22, 2018
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