A study on the effect of inter-electrode gap and pulse voltage on current density in electrochemical additive manufacturing

A study on the effect of inter-electrode gap and pulse voltage on current density in... Keywords Pulse electrodeposition model · Electrochemical additive manufacturing · Inter-electrode gap · High current density nickel deposition Extended author information available on the last page of the article Vol.:(0123456789) 1 3 464 Journal of Applied Electrochemistry (2018) 48:463–469 their alloys [11, 12]. LECD using bipolar electrochemistry 1 Introduction with currents lower than the limiting current region was used to deposit copper on to gold electrodes where second- Additive Manufacturing (AM) is defined as a process of ary current distribution was computed numerically in the joining materials to make parts from 3D model data, usu- study to predict the deposition profile [13]. ally layer upon layer, as opposed to subtractive manufac- Modeling the mass transfer-controlled Nickel electroplat- turing and formative manufacturing methodologies [1]. ing was performed, where the effect of pulsed current on the Parts produced by AM of metals using energy beam-based process was studied theoretically and validated experimen- methods are increasingly being used in the industry for tally with a sensitivity analysis performed to identify the functional applications [2]. However, traditional ther- critical process parameters [14]. Numerical modeling of the mal-based metal additive manufacturing has limitations copper electrodeposition under pulse current conditions was such as residual stress in the parts and http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Journal of Applied Electrochemistry Springer Journals

A study on the effect of inter-electrode gap and pulse voltage on current density in electrochemical additive manufacturing

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Publisher
Springer Netherlands
Copyright
Copyright © 2018 by Springer Science+Business Media B.V., part of Springer Nature
Subject
Chemistry; Electrochemistry; Physical Chemistry; Industrial Chemistry/Chemical Engineering
ISSN
0021-891X
eISSN
1572-8838
D.O.I.
10.1007/s10800-018-1177-3
Publisher site
See Article on Publisher Site

Abstract

Keywords Pulse electrodeposition model · Electrochemical additive manufacturing · Inter-electrode gap · High current density nickel deposition Extended author information available on the last page of the article Vol.:(0123456789) 1 3 464 Journal of Applied Electrochemistry (2018) 48:463–469 their alloys [11, 12]. LECD using bipolar electrochemistry 1 Introduction with currents lower than the limiting current region was used to deposit copper on to gold electrodes where second- Additive Manufacturing (AM) is defined as a process of ary current distribution was computed numerically in the joining materials to make parts from 3D model data, usu- study to predict the deposition profile [13]. ally layer upon layer, as opposed to subtractive manufac- Modeling the mass transfer-controlled Nickel electroplat- turing and formative manufacturing methodologies [1]. ing was performed, where the effect of pulsed current on the Parts produced by AM of metals using energy beam-based process was studied theoretically and validated experimen- methods are increasingly being used in the industry for tally with a sensitivity analysis performed to identify the functional applications [2]. However, traditional ther- critical process parameters [14]. Numerical modeling of the mal-based metal additive manufacturing has limitations copper electrodeposition under pulse current conditions was such as residual stress in the parts and

Journal

Journal of Applied ElectrochemistrySpringer Journals

Published: Feb 22, 2018

References

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