Access the full text.
Sign up today, get DeepDyve free for 14 days.
AA Orouji, A Pak (2015)
A novel technique for electric field control to improve breakdown voltageMater. Sci. Semicond. Process., 34
Yuanzheng Zhu, Yung Liang, Shuming Xu, P. Foo, J. Sin (2001)
Folded gate LDMOS transistor with low on-resistance and high transconductanceIEEE Transactions on Electron Devices, 48
C. Fink, J. Schulze, I. Eisele, W. Hansch, W. Werner, W. Kanert (2000)
Vertical power-MOSFETs with local channel dopingInternational Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)
M. Mehrad (2016)
Periodic trench region in LDMOS transistor: A new reliable structure with high breakdown voltageSuperlattices and Microstructures, 91
Y. Singh, M. Punetha (2013)
A Lateral Trench Dual Gate Power MOSFET on Thin SOI for Improved PerformanceECS Journal of Solid State Science and Technology, 2
B. Duan, Yintang Yang, Bo Zhang, Xufeng Hong (2009)
Folded-Accumulation LDMOST: New Power MOS Transistor With Very Low Specific On-ResistanceIEEE Electron Device Letters, 30
A. Pak, A. Orouji (2016)
A novel laminated gate to improve the ON-state resistance of LDMOS transistorsJournal of Computational Electronics, 15
X. Luo, Jie Fan, Yuangang Wang, T. Lei, M. Qiao, Bo Zhang, Florin Udrea (2011)
Ultralow Specific On-Resistance High-Voltage SOI Lateral MOSFETIEEE Electron Device Letters, 32
Liu Pengcheng, L. Xiaorong, Luo Yinchun, K. Zhou, Shi Xianlong, Yanhui Zhang, Mengshan Lv (2015)
An ultra-low specific on-resistance trench LDMOS with a U-shaped gate and accumulation layer*Chinese Physics B, 24
G. Ma, W. Burger, C. Dragon, T. Gillenwater (1996)
High efficiency LDMOS power FET for low voltage wireless communicationsInternational Electron Devices Meeting. Technical Digest
王卓, 李鹏程, 张波, 范远航, 徐青, 罗小蓉 (2015)
Ultralow Specific on-Resistance Trench MOSFET with a U-Shaped Extended Gate
Lingli Jiang, M. Qiao, Zhaoji Li, Bo Zhang (2009)
A novel double RESURF LDMOS with optimized ESD robustness2009 International Conference on Communications, Circuits and Systems
Y. Fong, G. Liang, T. Duzer, C. Hu (1992)
Channel width effect on MOSFET breakdownIEEE Transactions on Electron Devices, 39
(1998)
A 33 V, 0.25 μm-cm 2 n-channel LDMOS in a 0.65 μ m smart power technology for 20–30 V applications
X. Luo, Da Ma, Qiao Tan, Jie Wei, Junfeng Wu, K. Zhou, T. Sun, Qing Liu, Bo Zhang, Zhaoji Li (2016)
A Split Gate Power FINFET With Improved ON-Resistance and Switching PerformanceIEEE Electron Device Letters, 37
A. Yoo, Y. Onish, E. Xu, W. Ng (2009)
A Low-Voltage Lateral SJ-FINFET With Deep-Trench p-Drift RegionIEEE Electron Device Letters, 30
Qin Xu, Yufeng Guo, Ying Zhang, Lei-lei Liu, Jiafei Yao, G. Sheu (2012)
A Novel RF SOI LDMOS with a Raised Drift RegionProcedia Engineering, 29
(2012)
Atlas User's Manual: Device simulation software
E. Kobori, N. Izumi, N. Kumamoto, Y. Hamazawa, M. Matsumoto, K. Yamamoto, A. Kamisawa (1999)
Efficiency of power devices using full Cu metallization technologies11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312)
E. Arnold (1994)
Silicon-on-insulator devices for high voltage and power IC applicationsJournal of The Electrochemical Society, 141
A. Orouji, A. Pak (2015)
Numerical simulation of lateral diffused metal oxide semiconductor field effect transistors: A novel technique for electric field control to improve breakdown voltageMaterials Science in Semiconductor Processing, 34
Y. Singh, R. Rawat (2015)
High figure-of-merit SOI power LDMOS for power integrated circuitsEngineering Science and Technology, an International Journal, 18
K. Varadarajan, T. Chow, J. Wang, R. Liu, F. Gonzalez (2007)
250V Integrable Silicon Lateral Trench Power MOSFETs with Superior Specific On-ResistanceProceedings of the 19th International Symposium on Power Semiconductor Devices and IC's
C. Xia, Xinhong Cheng, Zhongjian Wang, Dawei Xu, D. Cao, Li Zheng, Lingyan Shen, Yuehui Yu, D. Shen (2014)
Improvement of SOI Trench LDMOS Performance With Double Vertical Metal Field PlateIEEE Transactions on Electron Devices, 61
M. Qiao, Yuru Wang, Xin Zhou, Feng Jin, Huihui Wang, Zhuo Wang, Zhaoji Li, Bo Zhang (2015)
Analytical Modeling for a Novel Triple RESURF LDMOS With N-Top LayerIEEE Transactions on Electron Devices, 62
T. Erlbacher (2014)
Lateral Power Transistors in Integrated Circuits
In this paper, we propose a novel high channel density LDMOS transistor (HCD-LDMOS) with low specific on-resistance and high transconductance. This is achieved primarily through increased channel density to improve transistor performance via the creation of a U-shaped structure. The channel density is significantly increased when one extra etching process is added to create the U-shaped structure, resulting in a 68.42% reduction in specific on-resistance compared with a conventional structure (C-LDMOS). In addition, the gate control over the channel of the HCD-LDMOS is improved, and a marked increase in the peak transconductance value is achieved. Another key advantage is the lower electron temperature relative to the C-LDMOS. Using the U-shaped formation of the HCD-LDMOS structure, increases the uniformity of the electric field. This smoothing effect leads to a reduction in electron temperature and greater device reliability. The only difference between the C-LDMOS and the proposed structure is the addition of one extra etching process.
Journal of Computational Electronics – Springer Journals
Published: Sep 15, 2017
Read and print from thousands of top scholarly journals.
Already have an account? Log in
Bookmark this article. You can see your Bookmarks on your DeepDyve Library.
To save an article, log in first, or sign up for a DeepDyve account if you don’t already have one.
Copy and paste the desired citation format or use the link below to download a file formatted for EndNote
Access the full text.
Sign up today, get DeepDyve free for 14 days.
All DeepDyve websites use cookies to improve your online experience. They were placed on your computer when you launched this website. You can change your cookie settings through your browser.