A novel approach of high-performance grinding using developed diamond wheels

A novel approach of high-performance grinding using developed diamond wheels A novel approach of high-performance grinding is proposed using developed diamond wheels, to obtain minimally damaged surface layer in silicon wafers. For this reason, resin bond diamond wheels are specifically developed with lanthanum oxide (La2O3), magnesium oxide (MgO), and ceria (CeO2) as additives, respectively. The wheels contain grains with a mesh number of 20,000 and a volume fraction of diamond grains of 37.5%. The diamond wheel with ceria additives demonstrates the best grinding performance in terms of surface integrity and roughness. It allows to generate an amorphous surface layer of 43 nm in thickness, without grinding damage beneath in a silicon wafer. This is different from previous reports, in which an amorphous layer is at the top, followed by a damaged crystalline layer underneath induced by a diamond wheel. Below the amorphous layer is the pristine crystalline lattice, which is confirmed using the high-resolution transmission electron microscopy (HRTEM). The ceria wheel results in a surface roughness R a of 0.88 nm and a peak-to-valley (PV) value of 8.3 nm over an area of 70 × 50 μm2 on a Si wafer at a feed rate of 15 μm/min. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png The International Journal of Advanced Manufacturing Technology Springer Journals

A novel approach of high-performance grinding using developed diamond wheels

Loading next page...
 
/lp/springer_journal/a-novel-approach-of-high-performance-grinding-using-developed-diamond-N2tbPxaL2s
Publisher
Springer London
Copyright
Copyright © 2017 by Springer-Verlag London
Subject
Engineering; Industrial and Production Engineering; Media Management; Mechanical Engineering; Computer-Aided Engineering (CAD, CAE) and Design
ISSN
0268-3768
eISSN
1433-3015
D.O.I.
10.1007/s00170-017-0037-3
Publisher site
See Article on Publisher Site

Abstract

A novel approach of high-performance grinding is proposed using developed diamond wheels, to obtain minimally damaged surface layer in silicon wafers. For this reason, resin bond diamond wheels are specifically developed with lanthanum oxide (La2O3), magnesium oxide (MgO), and ceria (CeO2) as additives, respectively. The wheels contain grains with a mesh number of 20,000 and a volume fraction of diamond grains of 37.5%. The diamond wheel with ceria additives demonstrates the best grinding performance in terms of surface integrity and roughness. It allows to generate an amorphous surface layer of 43 nm in thickness, without grinding damage beneath in a silicon wafer. This is different from previous reports, in which an amorphous layer is at the top, followed by a damaged crystalline layer underneath induced by a diamond wheel. Below the amorphous layer is the pristine crystalline lattice, which is confirmed using the high-resolution transmission electron microscopy (HRTEM). The ceria wheel results in a surface roughness R a of 0.88 nm and a peak-to-valley (PV) value of 8.3 nm over an area of 70 × 50 μm2 on a Si wafer at a feed rate of 15 μm/min.

Journal

The International Journal of Advanced Manufacturing TechnologySpringer Journals

Published: Jan 22, 2017

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create lists to
organize your research

Export lists, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off