A new technology for manufacturing the dielectric isolation of elements of microelectronic devices by oxidizing grooves in single-crystal silicon

A new technology for manufacturing the dielectric isolation of elements of microelectronic... The formation of the dielectric isolation of elements of microelectronic devices by oxidizing grooves in single-crystal silicon is considered. The new technological process makes it possible to shorten the manufacturing cycle and to improve the reliability and parameters of devices. It is shown that this result is attained by substantially shortening the time of oxidation of silicon, suppressing the “bird’s beak” irregularity, and reducing the capacitance of the metal-insulator-semiconductor structure through the etching of grooves with certain geometric parameters in silicon nitride. These parameters are the groove width 0.5–1.5 μm, the ratio of the width to the spacing between the grooves 0.56: 0.44, and the groove depth, which is larger than the width. The results of two-dimensional physical simulation support the advantages of the new technology over the standard process. The simulation was accomplished with the use of the SSUPREM4 program of the Silvaco bundled software. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Russian Microelectronics Springer Journals

A new technology for manufacturing the dielectric isolation of elements of microelectronic devices by oxidizing grooves in single-crystal silicon

Loading next page...
 
/lp/springer_journal/a-new-technology-for-manufacturing-the-dielectric-isolation-of-GC4R00obl6
Publisher
Springer Journals
Copyright
Copyright © 2010 by Pleiades Publishing, Ltd.
Subject
Engineering; Electrical Engineering
ISSN
1063-7397
eISSN
1608-3415
D.O.I.
10.1134/S1063739710010026
Publisher site
See Article on Publisher Site

Abstract

The formation of the dielectric isolation of elements of microelectronic devices by oxidizing grooves in single-crystal silicon is considered. The new technological process makes it possible to shorten the manufacturing cycle and to improve the reliability and parameters of devices. It is shown that this result is attained by substantially shortening the time of oxidation of silicon, suppressing the “bird’s beak” irregularity, and reducing the capacitance of the metal-insulator-semiconductor structure through the etching of grooves with certain geometric parameters in silicon nitride. These parameters are the groove width 0.5–1.5 μm, the ratio of the width to the spacing between the grooves 0.56: 0.44, and the groove depth, which is larger than the width. The results of two-dimensional physical simulation support the advantages of the new technology over the standard process. The simulation was accomplished with the use of the SSUPREM4 program of the Silvaco bundled software.

Journal

Russian MicroelectronicsSpringer Journals

Published: Jan 21, 2010

References

You’re reading a free preview. Subscribe to read the entire article.


DeepDyve is your
personal research library

It’s your single place to instantly
discover and read the research
that matters to you.

Enjoy affordable access to
over 18 million articles from more than
15,000 peer-reviewed journals.

All for just $49/month

Explore the DeepDyve Library

Search

Query the DeepDyve database, plus search all of PubMed and Google Scholar seamlessly

Organize

Save any article or search result from DeepDyve, PubMed, and Google Scholar... all in one place.

Access

Get unlimited, online access to over 18 million full-text articles from more than 15,000 scientific journals.

Your journals are on DeepDyve

Read from thousands of the leading scholarly journals from SpringerNature, Elsevier, Wiley-Blackwell, Oxford University Press and more.

All the latest content is available, no embargo periods.

See the journals in your area

DeepDyve

Freelancer

DeepDyve

Pro

Price

FREE

$49/month
$360/year

Save searches from
Google Scholar,
PubMed

Create lists to
organize your research

Export lists, citations

Read DeepDyve articles

Abstract access only

Unlimited access to over
18 million full-text articles

Print

20 pages / month

PDF Discount

20% off