Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You and Your Team.

Learn More →

Study into grinding force in back grinding of wafer with outer rim

Study into grinding force in back grinding of wafer with outer rim Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Advances in Manufacturing Springer Journals

Study into grinding force in back grinding of wafer with outer rim

Loading next page...
 
/lp/springer-journals/study-into-grinding-force-in-back-grinding-of-wafer-with-outer-rim-ZZUmZ0iCpa
Publisher
Springer Journals
Copyright
Copyright © Shanghai University and Springer-Verlag GmbH Germany, part of Springer Nature 2020
ISSN
2095-3127
eISSN
2195-3597
DOI
10.1007/s40436-020-00316-z
Publisher site
See Article on Publisher Site

Abstract

Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.

Journal

Advances in ManufacturingSpringer Journals

Published: Sep 18, 2020

There are no references for this article.