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Microstructural Response of Pure Copper to Cryogenic Rolling (PREPRINT)
The present study concerns the cryogenic processing of metals with simultaneous analysis of x-ray diffraction in a synchrotron ring. The mechanical properties improvement related to cryogenic processing of metals is attributed to the partial suppression of dynamic recovery. Thus, commercially pure metals with different stacking fault energies (silver, copper and aluminum) were deformed by uniaxial tensile tests and characterized by in situ x-ray diffraction, at room (293 K) and cryogenic (77 K) temperatures. The cryogenic processing allows a simultaneous improvement in ductility and strength for silver and copper and an improvement in strength for aluminum. This difference in mechanical properties was investigated by means of variations in crystallite size, microstrain and also the amount and size of dimples on the fracture surface. The microstructural refinement at cryogenic temperatures shows a tendency related to the stacking fault energies.
Journal of Materials Engineering and Performance – Springer Journals
Published: Jul 25, 2019
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